Conductive Post Antenna Package for Space-Constrained 5G Connections
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Solution Overview
Problem
Conventional wireless communication devices face challenges in miniaturization and space constraints for 5G antenna placement, as well as establishing effective electrical communication between the antenna and other components within portable electronic products.
Innovation Solution
An electronic package design featuring a carrier structure with an antenna function, a lead frame with conductive posts, and an encapsulant with distinct encapsulating portions, allowing the conductive posts to be exposed for connection to a connector, enabling flexible placement of the antenna near the housing and direct electrical connection to the mainboard without space limitations.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the antenna element is disposed near the housing to enhance signal strength, then the wireless communication performance is improved, but the device complexity and space management become problematic
Solution Approach 1:
The patent transitions from planar PCB mounting to three-dimensional vertical stacking by placing the antenna element on a separate carrier structure that can be positioned near the housing. The lead frame with conductive posts extends vertically to establish electrical connections, enabling spatial separation while maintaining electrical connectivity.
Solution Approach 2:
The patent divides the wireless communication device into functionally independent modules: the antenna element on the carrier structure, the lead frame for electrical connection, and the mainboard with other components. This segmentation allows the antenna to be positioned independently near the housing without constraining the layout of other components.
2Reliability
If the antenna element is disposed near the housing, then signal strength is enhanced, but the electrical connection to the mainboard becomes more difficult
Solution Approach 1:
The lead frame serves as an intermediary component between the antenna element on the carrier structure and the mainboard. The multiple conductive posts on the lead frame establish electrical pathways, mediating the connection between the spatially separated antenna and the mainboard without requiring direct contact or complex routing.
3Reliability
If conventional packaging is used with the antenna near the housing, then additional adapters are needed, but this increases device complexity and cost
Solution Approach 1:
The patent merges the antenna element, carrier structure, and lead frame into an integrated assembly. The carrier structure provides mechanical support for the antenna while the lead frame simultaneously provides electrical connection functionality, eliminating the need for separate adapters or additional connection components.
Solution Approach 2:
The carrier structure with integrated lead frame performs multiple functions: it provides mechanical support for the antenna element, enables positioning near the housing, and establishes electrical connections to the mainboard through conductive posts. This multi-functionality replaces what would otherwise require multiple separate components.
Data Source
AI summary
An electronic package is formed by disposing an electronic element and a lead frame having a plurality of conductive posts on a carrier structure having an antenna function, and encapsulating the electronic element and the lead frame with an encapsulant. The encapsulant is defined with a first encapsulating portion and a second encapsulating portion lower than the first encapsulating portion. The electronic element is positioned in the first encapsulating portion, and the plurality of conductive posts are positioned in the second encapsulating portion. End surfaces of the plurality of conductive posts are exposed from a surface of the second encapsulating portion so as to be electrically connected to a connector.