Conductive Post IC Packaging with Embedded Circuitry
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Solution Overview
Problem
Current integrated circuit packaging systems face challenges in simplifying manufacturing processes, reducing size and electrical components on circuit boards, improving time to market, and enhancing functionality while maintaining reliability and cost-effectiveness.
Innovation Solution
The integrated circuit packaging system incorporates conductive posts with specific characteristics, such as narrow shapes and materials like gold, silver, or aluminum, which are pre-fabricated and encapsulated with a shaped platform and encapsulant, allowing for improved connectivity and reduced manufacturing steps.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If traditional integrated circuit packaging methods are used, then manufacturing processes are well-established, but manufacturing complexity and number of process steps increase
Solution Approach 1:
The patent combines multiple separate manufacturing operations into a single integrated process. Specifically, the conductive post formation, encapsulant application, and platform shaping are merged into one continuous manufacturing step, eliminating the need for separate drilling, plating, and molding operations that would otherwise be required.
Solution Approach 2:
The conductive posts and encapsulant are pre-formed and positioned together as an integrated structure before final assembly. This preliminary integration of components simplifies the overall manufacturing process by reducing the number of subsequent assembly steps required.
2Adaptability or versatility
If more electrical parts and circuitry are added to improve functionality, then product features increase, but product size and circuit board size increase
Solution Approach 1:
The patent transitions from a planar circuit board layout to a three-dimensional stacked architecture. Conductive posts extend vertically through the encapsulant to provide electrical connections between different levels, enabling multiple circuit layers to be stacked in the vertical dimension rather than spreading out horizontally.
Solution Approach 2:
The integrated circuit device is nested within the encapsulant structure, with conductive posts providing vertical interconnections. This nested arrangement allows multiple functional components to be compactly integrated in three-dimensional space, reducing the overall footprint.
3Volume of moving object
If circuit board size is reduced to improve product compactness, then product size decreases, but the number of electrical parts and connections becomes more dense
Solution Approach 1:
By utilizing the vertical dimension with conductive posts extending through the encapsulant, the patent provides multiple connection points in the vertical direction. This three-dimensional connection architecture reduces the need for dense horizontal routing on the circuit board surface.
4Reliability
If manufacturing process steps are increased to improve reliability, then product reliability improves, but time to market and production efficiency decrease
Solution Approach 1:
The patent merges multiple quality-assurance steps into a single integrated process. The simultaneous formation of conductive posts, application of encapsulant, and shaping of platforms ensures proper alignment and connection integrity in one operation, maintaining reliability while improving production efficiency.
Data Source
AI summary
An integrated circuit packaging system includes: an integrated circuit device; a conductive post adjacent the integrated circuit device, the conductive post with a contact surface having characteristics of a shaped platform removed; and an encapsulant around the conductive post and the integrated circuit device with the conductive post extending through the encapsulant and each end of the conductive post exposed from the encapsulant.