Conductive Post IC Packaging Alignment and Density
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Solution Overview
Problem
The challenge is to develop an integrated circuit packaging system that achieves increased density, reduced size, and lower costs while addressing the limitations of existing technologies in miniaturization and cost reduction for portable electronic devices.
Innovation Solution
The solution involves a method of manufacturing an integrated circuit packaging system using a base carrier with conductive posts having a top protrusion, where a base integrated circuit is mounted over the carrier and encapsulated, with the conductive posts partially exposed within the encapsulation recess, enhancing reliability and alignment through improved solder joint strength and wettability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If integrated circuits are stacked into a single package to increase density, then packaging density is improved, but alignment precision deteriorates due to misalignment issues
Solution Approach 1:
Conductive posts are formed on the base carrier before mounting the integrated circuit, establishing precise alignment references in advance. The posts protrude through the encapsulation to provide predetermined alignment features for subsequent stacking operations, preventing misalignment issues.
Solution Approach 2:
The conductive posts serve as intermediary elements between the base carrier and the integrated circuit. These posts provide both electrical connection and mechanical alignment functions, acting as a mediator that ensures precise positioning while enabling high-density packaging.
2Volume of moving object
If package size is reduced to improve miniaturization, then product size is improved, but manufacturing complexity increases
Solution Approach 1:
The conductive posts combine multiple functions into a single structure: electrical connection, mechanical support, and alignment reference. This merging of functions simplifies the overall manufacturing process despite the reduced package size, as fewer separate components and alignment features are needed.
Solution Approach 2:
The conductive posts perform multiple roles simultaneously: they provide electrical interconnects between packages, serve as mechanical support structures, and act as alignment references for stacking. This multi-functionality reduces manufacturing complexity by eliminating the need for separate alignment features and support structures.
3Reliability
If conductive posts are fully exposed to improve solder joint strength, then reliability is improved, but mold flash problems increase
Solution Approach 1:
The conductive posts have different exposure levels at different locations: they protrude through the encapsulation to provide exposed contact surfaces for reliable soldering, while the majority of the post structure remains enclosed within the encapsulation to prevent mold flash accumulation. This local differentiation of quality optimizes both reliability and manufacturing.
Data Source
AI summary
A method of manufacture of an integrated circuit packaging system includes: providing a base carrier; forming a conductive post on the base carrier, the conductive post having a top protrusion with a protrusion top side; mounting a base integrated circuit over the base carrier; and forming a base encapsulation over the base integrated circuit, the base encapsulation having an encapsulation top side and an encapsulation recess with the conductive post partially exposed within the encapsulation recess, the encapsulation top side above the protrusion top side.