Conductive Post IC Packaging with Protection Layer
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Solution Overview
Problem
The challenge lies in creating integrated circuit packaging systems that are smaller, more reliable, and cost-effective, while maintaining high performance and functionality, as existing solutions have not adequately addressed the need for increased manufacturing throughput and reduced costs in a competitive market with shrinking package sizes and growing consumer demands.
Innovation Solution
The method involves a stack substrate with a conductive post and protection layer, where the conductive post is attached to the integrated circuit component and encapsulated, allowing for robust electrical and mechanical connections, reduced package height, and higher packaging density, eliminating voids and requiring fewer manufacturing steps.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If package size is reduced to meet market demands for smaller electronic products, then product size decreases, but manufacturing complexity and cost increase
Solution Approach 1:
The packaging system is divided into distinct functional segments: a base package containing the integrated circuit component, a stack substrate providing interconnection, and a conductive post structure for electrical connection. This segmentation allows each component to be optimized independently while reducing overall package size and simplifying manufacturing processes through modular assembly
Solution Approach 2:
The base package is nested within the stack substrate structure, with the conductive post integrated into the stack substrate. This nested configuration enables space-efficient packaging by utilizing vertical stacking rather than horizontal expansion, thereby reducing package footprint while maintaining electrical connectivity and simplifying the interconnection architecture
2Volume of moving object
If package size is reduced, then product size decreases, but reliability may deteriorate due to manufacturing challenges
Solution Approach 1:
The conductive post is pre-formed and pre-positioned on the stack substrate before final assembly with the base package. The protection layer is applied in advance to protect exposed conductive surfaces. These preliminary actions ensure proper alignment and electrical connectivity are established before encapsulation, improving reliability while maintaining compact dimensions
Solution Approach 2:
The stack substrate acts as an intermediary structure between the base package and external connections. It provides a stable platform for the conductive post and protection layer, mediating the mechanical and electrical interface while protecting the integrated circuit component. This intermediary structure enhances reliability by distributing mechanical stresses and ensuring robust electrical pathways in the reduced package size
3Productivity
If manufacturing throughput is increased to reduce costs, then productivity increases, but manufacturing precision may deteriorate
Solution Approach 1:
The manufacturing process is segmented into discrete, standardized steps: base package fabrication, stack substrate preparation with pre-formed conductive posts, protection layer application, and final assembly. This segmentation enables each step to be performed by specialized automated equipment with high precision, maintaining alignment accuracy while increasing overall manufacturing throughput through parallel processing and reduced rework
Solution Approach 2:
The conductive post structure with its protruded end and protection layer is designed to self-align with corresponding features on the base package during assembly. The protection layer geometry provides mechanical guidance that ensures proper positioning without requiring complex alignment mechanisms, thereby maintaining manufacturing precision while enabling high-speed automated assembly and increasing productivity
Data Source
AI summary
A method of manufacture of an integrated circuit packaging system includes: providing a stack substrate with a component side; connecting an integrated circuit component to the component side; attaching a conductive post to the component side and adjacent the integrated circuit component, the conductive post having a protruded end above the integrated circuit component; forming a protection layer on a top and sides of the protruded end, the protection layer having a width equal to a width of the conductive post; applying a stack encapsulation over the integrated circuit component, over the stack substrate, and around a portion of the conductive post, the protection layer exposed from the stack encapsulation; and mounting a base package under the stack substrate, base package connected to the stack substrate.