Conductive Circuit-Attached Preform for Blow Molding
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Solution Overview
Problem
Current methods for manufacturing plastic bottles with integrated conductive circuits face challenges such as inadequate heat transfer during blow molding, inability of conductive films to follow preform stretching, and ease of counterfeiting due to external film placement.
Innovation Solution
A manufacturing method involving a conductive circuit-attached film with stretchability integrated onto the internal surface of a preform during molding, allowing the film to follow preform stretching and preventing counterfeiting by internal integration.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a conductive circuit-attached film is placed on the outside of the preform, then the film can be easily replaced and counterfeited, but the heat transfer during blow molding is inadequate and the film cannot follow the stretch of the preform
Solution Approach 1:
The patent inverts the conventional approach by placing the conductive circuit-attached film on the internal surface of the preform rather than on the external surface. This inversion ensures that the film is integral to the preform structure, making it extremely difficult to counterfeit while also enabling effective heat transfer during blow molding since the film is now positioned where the heating element directly contacts the preform interior.
Solution Approach 2:
The patent merges the conductive circuit-attached film with the preform by integrating it into the internal surface during the molding process. This merging ensures that the film follows the stretch of the preform during blow molding and creates a unified structure that is resistant to counterfeiting, while also improving heat transfer efficiency.
2Ease of manufacture
If a conductive circuit-attached film is placed on the outside of the preform, then assembly is simple, but the film cannot follow the stretch of the preform during blow molding
Solution Approach 1:
The patent applies preliminary action by placing the conductive circuit-attached film on the internal surface of the mold cavity before injecting the molten resin. This preliminary positioning ensures that the film is integrated into the preform structure during molding, enabling it to follow the stretch perfectly while maintaining manufacturing simplicity through a single integrated process step.
Solution Approach 2:
The patent merges the film placement step with the preform molding step by integrating the film into the internal surface of the mold cavity. This merging ensures that the film is automatically positioned and integrated as the preform is formed, eliminating the need for separate assembly steps while ensuring the film follows the stretch perfectly.
3Ease of manufacture
If a conductive circuit-attached film is placed on the outside of the preform, then replacement is easy, but the conductive circuit becomes vulnerable to counterfeiting
Solution Approach 1:
The patent inverts the conventional approach by placing the conductive circuit-attached film on the internal surface of the preform rather than on the external surface. This inversion makes the film an integral part of the preform structure, eliminating the ability to replace or counterfeit the film while maintaining ease of manufacture through the integrated molding process.
Solution Approach 2:
The patent applies the nested doll principle by placing the conductive circuit-attached film inside the preform structure on the internal surface. This nesting ensures that the film is protected within the preform, making it impossible to remove or counterfeit, while the entire assembly can still be manufactured efficiently in a single molding process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables successful blow molding of conductive circuit-attached products where the conductive circuit remains integral and resistant to counterfeiting, ensuring effective heat transfer and durability.
Implementation Method 1
a conductive circuit-attached film (3) having stretchability
Implementation Method 2
heat of a heater during blow molding
Data Source
AI summary
A manufacturing method is configured to include arranging a conductive circuit-attached film, in which a conductive circuit having stretchability is formed on a base film, on a molding surface of a first mold having the molding surface for forming an internal surface of a preform; mold-clamping the first mold and a second mold paired with the first mold; molding the preform by injecting molten resin into a cavity formed by the mold-clamping; mold-opening the first mold and the second mold; taking out a conductive circuit-attached preform in which the conductive circuit-attached film and the preform are integrated; and blow-molding the conductive circuit-attached preform.