Conductive Projections for Edge Interconnects

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Solution Overview

Problem

Existing methods for interconnecting printed circuit substrates rely on mechanical connectors or cables, which increase the physical size and manufacturing complexity of substrate assemblies, and costs.

Innovation Solution

A substrate assembly design featuring conductive projections, such as cantilevered beams, that electrically connect microchips or substrates mounted on different elevations of a printed circuit substrate, eliminating the need for mechanical connectors by using conductive material to establish direct or indirect electrical contact.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If mechanical connectors or cables are used to connect printed circuit substrates, then electrical connectivity between substrates is achieved, but the physical size of the substrate assembly increases

Engineering Contradiction:

Improveelectrical connectivityVSAvoidphysical size of substrate assembly

Core Design Contradiction:

ReliabilityVSVolume of moving object

Solution Approach 1:

The patent extracts and eliminates the mechanical connector or cable from the substrate assembly, replacing it with a projection that is directly formed as part of the substrate structure. This removes the separate connecting component that was adding to the overall volume while maintaining the electrical connection function.

Inventive Principle:

Principle #2Taking out (Extraction)

Solution Approach 2:

The patent merges the electrical connection function with the substrate structure itself by forming the projection directly on the substrate. Instead of having a separate mechanical connector, the substrate and connector become a single integrated structure, reducing the overall assembly volume.

Inventive Principle:

Principle #5Merging (Combining)

2Reliability

If mechanical connectors or cables are used to connect printed circuit substrates, then electrical connectivity between substrates is achieved, but the manufacturing complexity increases due to additional mounting steps

Engineering Contradiction:

Improveelectrical connectivityVSAvoidmanufacturing complexity

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The patent combines the substrate manufacturing process with the connector formation process. The projection is formed during substrate fabrication using standard semiconductor manufacturing techniques, eliminating the separate mechanical mounting step that would be required for traditional connectors.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The patent replaces the mechanical connector mounting process with a semiconductor fabrication process. Instead of mechanically attaching connectors after substrate fabrication, the electrical connections are formed through deposition and patterning steps integrated into the substrate manufacturing flow.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

3Reliability

If mechanical connectors or cables are used to connect printed circuit substrates, then electrical connectivity between substrates is achieved, but the manufacturing cost increases

Engineering Contradiction:

Improveelectrical connectivityVSAvoidmanufacturing cost

Core Design Contradiction:

ReliabilityVSEase of manufacture

Solution Approach 1:

The patent replaces expensive mechanical connectors and their associated assembly processes with standard semiconductor manufacturing techniques. The projection is formed using existing deposition, patterning, and etching equipment, avoiding the need for specialized mechanical assembly tooling and processes.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The substrate structure provides its own connection mechanism through the projection that is self-formed during substrate fabrication. This eliminates the need for separate connector components and their associated procurement, inventory management, and assembly operations, reducing overall manufacturing cost.

Inventive Principle:

Principle #25Self-service

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This design reduces the physical size and manufacturing complexity of substrate assemblies, lowers costs, and simplifies the manufacturing process by eliminating the need for mechanical connectors, while maintaining effective electrical connectivity.

Implementation Method 1

the projection comprises conductive material... the free, distal ends of the first and second parts are in electrical contact

Methodology Applied

Scientific EffectElectrical conduction: Conduction (electrical)

Data Source

PatentUS11658432B2Edge interconnects for use with circuit boards and integrated circuits

Publication Date: 2023.05.23 INDIANA INTEGRATED CIRCUITS LLC

AI summary

A substrate assembly includes a printed circuit (PC) substrate, first and second microchips, components or substrates mounted on a surface of the PC substrate, and a projection extending in spaced relation to the surface of the PC substrate. In one example, the projection extends between (i) a downward facing surface and/or an edge of a side facing surface proximate the downward facing surface of the first microchip, component or substrate and (ii) an upward facing surface and/or an edge of a side facing surface proximate the upward facing surface of the first microchip, component or substrate. The first and second microchips, components or substrates may be mounted on different levels of the PC substrate surface. In another example, the projection extends between a upward and/or side facing surface of a first microchip, component or substrate and a slot or cavity in a second microchip, component or substrate.