Conductive Structure with Protrusions for Electromagnetic Heat Dissipation
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Solution Overview
Problem
Existing heat dissipation techniques for electromagnetic devices, such as liquid cooling and air cooling, are inefficient and costly, with liquid cooling prone to leaks and air cooling limited by the surface area of windings, failing to meet the heat dissipation needs of high-power devices.
Innovation Solution
A conductive structure with a conductive sheet and protrusions arranged between electrical connection terminals, creating non-planar surfaces for airflow to enhance heat dissipation, including multiple heat dissipation passages and varying cross-sectional patterns to increase airflow turbulence and contact area.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If liquid cooling is used, then heat dissipation ability is improved, but device complexity and cost increase due to additional accessories and joints
Solution Approach 1:
The invention extracts the heat dissipation function from the traditional liquid cooling system by integrating cooling fins directly into the conductive sheet structure. This eliminates the need for separate cooling plates, circulation systems, and associated accessories, thereby reducing device complexity while maintaining effective heat dissipation through the finned surface structure
Solution Approach 2:
The invention merges the conductive sheet with heat dissipation fins into a single integrated structure. The fins are directly formed on the conductive sheet, combining the electrical conduction function and thermal dissipation function into one component, which simplifies the overall device structure and reduces the number of joints and accessories
2Device complexity
If air cooling is used, then device complexity is reduced, but heat dissipation ability is limited by the surface area of the winding
Solution Approach 1:
The invention extends the heat dissipation surface from the two-dimensional winding surface to a three-dimensional structure by adding fins that protrude in the radial direction. This dimensional extension dramatically increases the heat dissipation surface area without increasing the device volume, allowing air cooling to achieve heat dissipation ability comparable to liquid cooling while maintaining low device complexity
Solution Approach 2:
The invention applies local quality enhancement by adding fins specifically to the conductive sheet where heat dissipation is most needed. The fins are strategically positioned to maximize surface area for heat transfer to the airflow, creating localized heat dissipation zones that enhance overall cooling efficiency without requiring complex system-wide changes
3Temperature
If protrusions are added to the conductive sheet, then heat dissipation ability is improved through increased surface area, but manufacturing complexity increases
Solution Approach 1:
The invention merges the protrusion formation process with the conductive sheet manufacturing process. The protrusions are formed as an integral part of the conductive sheet through a single fabrication process, eliminating the need for separate machining, assembly, or attachment steps, thereby maintaining ease of manufacture while achieving enhanced heat dissipation
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The conductive structure effectively improves heat dissipation by creating uneven surfaces for airflow, enhancing the heat transfer coefficient and increasing the contact area with airflow, thus addressing the inefficiencies of traditional cooling methods.
Implementation Method 1
The cool air flows into the airflow passage, and then, it absorbs heat and flows out of the airflow passage, so as to achieve heat dissipation
Implementation Method 2
The conductive sheet has two electrical connection terminals. The protrusions are arranged between the electrical connection terminals. The protrusions include a support which connects with the conductive sheet
Data Source
AI summary
A conductive structure for an electromagnetic device includes a conductive sheet and a plurality of protrusions. The conductive sheet includes two electrical connection terminals. The protrusions are arranged between the electrical connection terminals. The protrusions include a support. The support is connected to the conductive sheet. Adjacent two of the protrusions define a first heat dissipation passage.