Conductive Rail Layout Between Fins for IC Routing Density
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Solution Overview
Problem
The increasing complexity of interconnect routing in compact integrated circuits for semiconductor devices poses a challenge in reducing the layout area and increasing transistor count while maintaining performance and cost-effectiveness.
Innovation Solution
A conductive rail structure is introduced that connects transistors within an integrated circuit to power or ground levels, formed laterally between adjacent fin structures on a substrate, incorporating a layer of conductive material surrounded by insulating material, and extended parallel to the fin structures to alleviate metal line routing requirements.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If traditional metal line interconnect routing is used in compact integrated circuits, then transistors can be connected to power and ground levels, but the layout area increases and transistor count is limited due to routing complexity
Solution Approach 1:
The conductive rail structure extends laterally between adjacent fin structures in a horizontal dimension, rather than using traditional vertical metal line routing. This lateral extension parallel to the fin structures creates an additional routing dimension that simplifies power and ground connections while reducing layout area and interconnect complexity
Solution Approach 2:
The conductive rail structure is formed between individual fin structures or groups of fin structures, segmenting the routing function into discrete lateral sections. Each conductive rail serves specific adjacent fins, dividing the overall routing complexity into manageable segments that can be independently formed and connected
2Productivity
If more metal line interconnects are added to increase transistor count, then more transistors can be connected, but the layout area increases and cost-effectiveness decreases
Solution Approach 1:
The conductive rail structure serves multiple functions simultaneously: it provides power routing, ground routing, and acts as a structural element between fin structures. This multi-functionality allows increased transistor count to be supported without proportionally increasing interconnect area, as the same lateral space serves multiple electrical functions
Solution Approach 2:
The conductive rail structure merges the power and ground routing functions into a unified lateral structure that extends between fins. By combining these routing functions into a single integrated feature rather than separate metal lines, the layout area is reduced while supporting higher transistor counts
Data Source
AI summary
The present disclosure describes a semiconductor structure and a method for forming the same. The semiconductor structure can include a substrate, a first vertical structure and a second vertical structure formed over the substrate, and a conductive rail structure between the first and second vertical structures. A top surface of the conductive rail structure can be substantially coplanar with top surfaces of the first and the second vertical structures.