Conductive Resin Bank for Flexible LED Display Interconnects
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Solution Overview
Problem
Existing display devices face challenges in manufacturing complexity, high production costs, and energy consumption due to the need for solder patterns and bonding processes in electrical connections, while also requiring improved reliability and flexibility.
Innovation Solution
A display device design utilizing a bank made from a photosensitive resin containing conductive particles for direct mounting and electrical connection of light-emitting elements, eliminating the need for solder patterns and enhancing electrical pathways with adhesive support, and incorporating stress-relief patterns for flexibility.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If solder patterns and bonding processes are used for electrical connection, then reliable electrical connection is achieved, but manufacturing complexity and production cost increase
Solution Approach 1:
The patent merges the electrical connection function and adhesive support function into a single integrated bank structure. The bank comprises a photosensitive resin layer containing conductive particles, which simultaneously provides electrical pathways and adhesive support for mounting light-emitting elements, eliminating the need for separate solder patterns and bonding processes.
Solution Approach 2:
The bank is constructed using composite material consisting of photosensitive resin containing conductive particles. This composite material combines the adhesive properties of the photosensitive resin with the electrical conductivity of the conductive particles, enabling dual functionality in a single material layer.
2Reliability
If solder patterns and bonding processes are used for electrical connection, then reliable electrical connection is achieved, but production energy consumption increases
Solution Approach 1:
The patent extracts and eliminates the soldering and bonding processes from the manufacturing sequence by replacing them with a single UV curing process. The photosensitive resin is cured using UV light to simultaneously achieve adhesive bonding and electrical connection, removing the need for high-temperature soldering equipment and multiple processing steps.
3Reliability
If traditional bonding processes are used, then electrical connection is established, but manufacturing time and production cost increase
Solution Approach 1:
The conductive particles and adhesive material are pre-integrated into the bank structure before mounting the light-emitting elements. The bank is prepared in advance with the photosensitive resin layer containing conductive particles, so that when light-emitting elements are mounted and UV curing is applied, both adhesive bonding and electrical connection are achieved simultaneously in a single step.
4Reliability
If rigid structures are used for interconnects, then electrical integrity is maintained, but flexibility and adaptability decrease
Solution Approach 1:
The patent employs a flexible bank structure made of photosensitive resin that can accommodate bending and flexible display applications. The resin-based material provides flexibility while the embedded conductive particles maintain electrical pathways, enabling the interconnect structure to adapt to flexible and wearable display form factors.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design simplifies the manufacturing process, reduces costs and energy consumption, improves electrical connection reliability, and supports flexible display applications with enhanced light extraction and efficient power use.
Implementation Method 1
the photosensitive resin layer is irradiated with UV light to be cured, the light-emitting element and the bank are bonded to each other by the photosensitive resin layer
Implementation Method 2
a bank disposed on the first electrode; and a light-emitting element disposed on the bank and electrically connected to the first electrode via the bank wherein the bank include a photosensitive resin and at least one conductive path, in the photosensitive resin, which electrically connects the first electrode to the light-emitting element
Data Source
AI summary
The present application relates to a display device. The display device includes a substrate, an insulating layer disposed on the substrate, and a first electrode disposed on the insulating layer. A bank is disposed on the first electrode, and a light-emitting element is disposed on the bank. The light-emitting element is electrically connected to the first electrode via the bank. The bank includes a photosensitive resin and conductive particles that form at least one conductive path, enabling electrical connection between the light-emitting element and the first electrode.