Thermally Conductive Resin for Composite Curing

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Solution Overview

Problem

Thick composite laminate materials in aerospace applications require lengthy cure cycles due to exothermic reactions, which can lead to uncontrolled heat generation and potential thermal degradation, limiting production efficiency and increasing costs.

Innovation Solution

Incorporating conductive additives such as multi-walled carbon nanotubes, graphene, or graphite into the resin system to create pathways for heat dissipation during the curing process, allowing for quicker heat removal and reduced temperature dwell times.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If conventional curing processes are used for thick composite laminates, then the composite structure achieves proper curing and strength, but the cure time becomes excessively long (20 hours or more) and heat buildup occurs

Engineering Contradiction:

Improvecuring qualityVSAvoidcure time

Core Design Contradiction:

ReliabilityVSLoss of time

Solution Approach 1:

The patent applies composite materials by incorporating thermally conductive additives (such as aluminum oxide, boron nitride, or carbon-based materials) into the polymer resin matrix. This creates a composite resin system that maintains the chemical curing properties of the original resin while adding thermal conductivity to facilitate heat dissipation during the exothermic curing process, thereby reducing cure time without compromising curing quality

Inventive Principle:

Principle #40Composite materials

Solution Approach 2:

The patent changes the thermal parameters of the resin system by adding conductive fillers that modify the thermal conductivity of the material. This parameter change allows the resin to conduct heat away from the curing composite more effectively, preventing heat buildup and enabling faster curing cycles while maintaining proper curing conditions

Inventive Principle:

Principle #35Parameter changes

2Reliability

If conventional resin systems are used in thick composite laminates, then the material maintains proper chemical properties for curing, but heat dissipation becomes insufficient leading to thermal degradation

Engineering Contradiction:

Improvecuring process stabilityVSAvoidheat buildup

Core Design Contradiction:

ReliabilityVSObject-affected harmful factors

Solution Approach 1:

The patent creates a composite resin system by combining the base polymer resin with thermally conductive filler materials. This composite approach preserves the chemical curing properties of the original resin while introducing enhanced thermal conductivity to actively dissipate heat during the exothermic reaction, preventing thermal degradation

Inventive Principle:

Principle #40Composite materials

Solution Approach 2:

The thermally conductive additives serve as intermediary elements within the resin system, acting as thermal pathways that mediate heat transfer from the curing composite to the surrounding environment. These additives facilitate heat dissipation without interfering with the chemical curing process, effectively managing thermal buildup

Inventive Principle:

Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach reduces cure times, enhances production throughput, and mitigates composite structure damage, leading to cost savings and improved thermal management in composite materials.

Implementation Method 1

wicking away the heat from the composite preform layers via the conductive resin, such as the conductive pathways created by the conductive particles or short fibers disposed in the resin

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS11826993B2Thermally conductive curing process for composite rotorcraft structure fabrication

Publication Date: 2023.11.28 TEXTRON INNOVATIONS INC

AI summary

A thermally conductive curing process adds conductive additives to create pathways for dissipating heat during a curing process, thereby reducing the cure time, increasing the output capability, and reducing cost. Conductive particles or short fibers can be dispersed throughout the resin system or composite fiber layers in pre-impregnated or RTM-processed composite material. By disposing conductive particles or short fibers in a resin as part of the curing process, heat generated during the curing process can dissipate more quickly from any type of composite, especially thick composites. Conductive additive examples include multi-walled carbon nanotubes (MWCNTs), single-walled carbon nanotubes (SWCNTs), graphene/graphite powder, buckyballs, short fibrous particulate, nano-clays, nano-particles, and other suitable materials.