Conductive Resin Composition Curing at Normal Temperature
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Solution Overview
Problem
Conventional electrically conductive heat-curable epoxy adhesives require high-temperature curing (at least 150°C) to achieve excellent electrical conductivity, which is not compatible with energy-saving production processes that eliminate heat sources.
Innovation Solution
An electrically conductive resin composition comprising an epoxy resin, spike-shaped electrically conductive fillers, and a curing agent for epoxy resin, which cures at normal temperatures (5 to 50°C) and produces a cured product with excellent electrical conductivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If high-temperature curing (at least 150°C) is used to achieve excellent electrical conductivity, then electrical conductivity is improved, but energy consumption increases and compatibility with energy-saving production processes deteriorates
Solution Approach 1:
The patent changes the curing temperature parameter from high temperature (150°C or higher) to normal temperature (5 to 50°C) by selecting specific epoxy resins and curing agents that can react effectively at lower temperatures, thereby reducing energy consumption while maintaining electrical conductivity
Solution Approach 2:
The patent uses a composite formulation combining specific epoxy resins (including glycidylamine resins), spike-shaped conductive fillers, and curing agents to achieve both low-temperature curing capability and excellent electrical conductivity, resolving the contradiction between temperature reduction and performance maintenance
2Reliability
If high-temperature curing (at least 150°C) is used to achieve excellent electrical conductivity, then electrical conductivity is improved, but compatibility with energy-saving production processes deteriorates
Solution Approach 1:
The patent modifies the curing temperature parameter to normal temperature range (5 to 50°C), making the adhesive compatible with energy-saving production processes that eliminate high-temperature heat sources, while still achieving excellent electrical conductivity through optimized material selection
3Use of energy by moving object
If normal temperature curing (5 to 50°C) is used to reduce energy consumption, then energy consumption is reduced, but achieving excellent electrical conductivity becomes difficult
Solution Approach 1:
The patent employs a composite system comprising specific epoxy resins (including glycidylamine resins), spike-shaped conductive fillers, and curing agents that can effectively cure at normal temperatures while forming a matrix that supports excellent electrical conductivity, thus achieving both low energy consumption and high reliability
Solution Approach 2:
The patent optimizes the chemical composition parameters of the epoxy resin and curing agent to enable effective crosslinking reactions at normal temperatures, creating a cured product structure that facilitates electrical conductivity without requiring high-temperature processing
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition effectively cures at room temperature while maintaining excellent electrical conductivity, making it suitable for use in energy-saving production lines for electronic components without the need for high-temperature processing.
Implementation Method 1
an epoxy resin as component (A), and a curing agent for epoxy resin as component (C)
Implementation Method 2
a spike-shaped electrically conductive filler as component (B)... the cured product thereof has excellent electrical conductivity
Data Source
AI summary
An object of the invention is to provide an electrically conductive resin composition that cures at normal temperature (5 to 50°C), and the cured product thereof having excellent electrical conductivity. An electrically conductive resin composition includes an epoxy resin as component (A), an electrically conductive spike-shaped filler as component (B), and a curing agent for epoxy resin as component (C).


