Conductive Resin Composition Curing at Normal Temperature

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Solution Overview

Problem

Conventional electrically conductive heat-curable epoxy adhesives require high-temperature curing (at least 150°C) to achieve excellent electrical conductivity, which is not compatible with energy-saving production processes that eliminate heat sources.

Innovation Solution

An electrically conductive resin composition comprising an epoxy resin, spike-shaped electrically conductive fillers, and a curing agent for epoxy resin, which cures at normal temperatures (5 to 50°C) and produces a cured product with excellent electrical conductivity.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If high-temperature curing (at least 150°C) is used to achieve excellent electrical conductivity, then electrical conductivity is improved, but energy consumption increases and compatibility with energy-saving production processes deteriorates

Engineering Contradiction:
Improveelectrical conductivityVSAvoidenergy consumption
Core Design Contradiction:
ReliabilityVSUse of energy by moving object

Solution Approach 1:

The patent changes the curing temperature parameter from high temperature (150°C or higher) to normal temperature (5 to 50°C) by selecting specific epoxy resins and curing agents that can react effectively at lower temperatures, thereby reducing energy consumption while maintaining electrical conductivity

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The patent uses a composite formulation combining specific epoxy resins (including glycidylamine resins), spike-shaped conductive fillers, and curing agents to achieve both low-temperature curing capability and excellent electrical conductivity, resolving the contradiction between temperature reduction and performance maintenance

Inventive Principle:
Principle #40Composite materials

2Reliability

If high-temperature curing (at least 150°C) is used to achieve excellent electrical conductivity, then electrical conductivity is improved, but compatibility with energy-saving production processes deteriorates

Engineering Contradiction:
Improveelectrical conductivityVSAvoidcompatibility with energy-saving production processes
Core Design Contradiction:
ReliabilityVSAdaptability or versatility

Solution Approach 1:

The patent modifies the curing temperature parameter to normal temperature range (5 to 50°C), making the adhesive compatible with energy-saving production processes that eliminate high-temperature heat sources, while still achieving excellent electrical conductivity through optimized material selection

Inventive Principle:
Principle #35Parameter changes

3Use of energy by moving object

If normal temperature curing (5 to 50°C) is used to reduce energy consumption, then energy consumption is reduced, but achieving excellent electrical conductivity becomes difficult

Engineering Contradiction:
Improveenergy consumptionVSAvoidelectrical conductivity
Core Design Contradiction:
Use of energy by moving objectVSReliability

Solution Approach 1:

The patent employs a composite system comprising specific epoxy resins (including glycidylamine resins), spike-shaped conductive fillers, and curing agents that can effectively cure at normal temperatures while forming a matrix that supports excellent electrical conductivity, thus achieving both low energy consumption and high reliability

Inventive Principle:
Principle #40Composite materials

Solution Approach 2:

The patent optimizes the chemical composition parameters of the epoxy resin and curing agent to enable effective crosslinking reactions at normal temperatures, creating a cured product structure that facilitates electrical conductivity without requiring high-temperature processing

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The composition effectively cures at room temperature while maintaining excellent electrical conductivity, making it suitable for use in energy-saving production lines for electronic components without the need for high-temperature processing.

Implementation Method 1

an epoxy resin as component (A), and a curing agent for epoxy resin as component (C)

Methodology Applied
Scientific EffectEpoxy-curing agent chemical reaction: Chemical Bonding

Implementation Method 2

a spike-shaped electrically conductive filler as component (B)... the cured product thereof has excellent electrical conductivity

Methodology Applied
Scientific EffectElectrical conduction: Conduction (electrical)

Data Source

PatentEP4541852A1Electrically conductive resin composition and cured product thereof
Publication Date: 2025.04.23 THREE BOND CO LTD
  • EP4541852A1 patent drawing
  • EP4541852A1 patent drawing
  • EP4541852A1 patent drawing

AI summary

An object of the invention is to provide an electrically conductive resin composition that cures at normal temperature (5 to 50°C), and the cured product thereof having excellent electrical conductivity. An electrically conductive resin composition includes an epoxy resin as component (A), an electrically conductive spike-shaped filler as component (B), and a curing agent for epoxy resin as component (C).