Conductive Resin Composition for Stable Cu Electrode Viscosity
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Solution Overview
Problem
Existing thermosetting conductive resin compositions using thermosetting silicone resin with hydroxyl groups and conductive powders like Cu face issues with viscosity increase over time and decreased conductivity.
Innovation Solution
Incorporating at least one of an amine-based additive and an acid-based additive into the thermosetting conductive resin composition, along with a conductive powder including a base metal like Cu and a thermosetting silicone resin having hydroxyl groups, to achieve high viscosity stability and reduced conductivity decrease.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a thermosetting silicone resin having hydroxyl groups and conductive powder including base metal Cu are used in the composition, then moisture resistance and conductivity are improved, but viscosity increases over time and conductivity decreases
Solution Approach 1:
An amine-based additive or acid-based additive is introduced as an intermediary substance between the thermosetting silicone resin having hydroxyl groups and the conductive powder including base metal Cu. This additive mediates the interaction between the resin and conductive powder, preventing direct reactions that would cause viscosity increase and conductivity decrease, while still allowing the composition to achieve moisture resistance and excellent conductivity.
2Reliability
If conductive powder including base metal Cu is used to achieve excellent conductivity, then conductivity is improved, but viscosity increases over time
Solution Approach 1:
The amine-based additive or acid-based additive serves as a mediator between the conductive powder including base metal Cu and the thermosetting silicone resin. This intermediary prevents direct adverse interactions between the Cu powder and resin that would cause viscosity increase, while maintaining the excellent conductivity provided by the Cu powder.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The proposed solution results in a thermosetting conductive resin composition with excellent viscosity stability and maintained conductivity, even when using Cu as the conductive powder, thereby ensuring high moisture resistance and effective electrode formation for electronic components.
Implementation Method 1
a thermosetting conductive resin composition includes the conductive powder including a base metal such as Cu, the thermosetting silicone resin having hydroxyl groups, and in addition to these components, at least one of an amine-based additive and an acid-based additive
Data Source
AI summary
Provided is a thermosetting conductive resin composition including: a conductive powder including a base metal; a thermosetting silicone resin having hydroxyl groups; and at least one of an amine-based additive and an acid-based additive. According to the present invention, a thermosetting conductive resin composition for forming electrodes of electronic components can be provided that has high viscosity stability and can form a conductive resin layer having a reduced decrease in conductivity (excellent conductivity) and excellent moisture resistance, even when the thermosetting silicone resin having hydroxyl groups and the conductive powder including a base metal such as Cu are included.