Conductive Resin Composition for Suppressing Unintended Curing

Resolve Bottlenecks,
Find Innovative SolutionsGenerate Solutions

Solution Overview

Problem

The stability of 2-methylene-1,3-dicarbonyl compounds is significantly deteriorated when combined with conductive particles, leading to unintended curing, making their application in electronic components impractical unless unintended curing is suppressed.

Innovation Solution

Incorporating a monocarboxylic acid with three or more carbon atoms into the resin composition, which stabilizes the 2-methylene-1,3-dicarbonyl compound and prevents unintended curing when used with conductive particles.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If a 2-methylene-1,3-dicarbonyl compound is combined with conductive particles, then the resin composition can be used for electronic components, but the stability of the compound is deteriorated and unintended curing occurs

Engineering Contradiction:

Improveapplicability to electronic componentsVSAvoidstability of 2-methylene-1,3-dicarbonyl compound

Core Design Contradiction:

Adaptability or versatilityVSStability of the object's composition

Solution Approach 1:

A basic substance is introduced as an intermediary component that selectively interacts with the 2-methylene-1,3-dicarbonyl compound to suppress its unintended polymerization. The basic substance acts as a mediator that prevents direct harmful interactions between the compound and conductive particles, thereby maintaining stability while enabling use in electronic component pastes.

Inventive Principle:

Principle #24Intermediary (Mediator)

Solution Approach 2:

The invention changes the chemical environment by introducing a basic substance that alters the reactivity parameters of the 2-methylene-1,3-dicarbonyl compound. This parameter change suppresses the unwanted polymerization reaction while maintaining the compound's intended functionality, resolving the stability issue when combined with conductive particles.

Inventive Principle:

Principle #35Parameter changes

2Productivity

If a 2-methylene-1,3-dicarbonyl compound is used as a curable resin, then curing can be achieved in a short time at low temperature, but unintended curing occurs in the presence of conductive particles

Engineering Contradiction:

Improvecuring speedVSAvoidcontrol of curing timing

Core Design Contradiction:

ProductivityVSReliability

Solution Approach 1:

The basic substance serves as a mediator that controls the interaction between the 2-methylene-1,3-dicarbonyl compound and conductive particles. It prevents premature polymerization by selectively binding to or neutralizing potential initiators, thereby maintaining reliability of curing timing while preserving the fast low-temperature curing capability.

Inventive Principle:

Principle #24Intermediary (Mediator)

Solution Approach 2:

The basic substance provides preliminary anti-action by preventing unintended polymerization before it can occur. It counteracts the harmful effect of conductive particles that would otherwise trigger premature curing, ensuring that the compound remains stable until intentional curing is desired.

Inventive Principle:

Principle #9Preliminary anti-action

3Stability of the object's composition

If various acids are used as stabilizers for the 2-methylene-1,3-dicarbonyl compound, then stability is improved, but unintended curing is not suppressed in the presence of conductive particles

Engineering Contradiction:

Improvestability of 2-methylene-1,3-dicarbonyl compoundVSAvoidsuppression of unintended curing

Core Design Contradiction:

Stability of the object's compositionVSReliability

Solution Approach 1:

Instead of using acids as stabilizers (the conventional approach), the invention inverts the strategy by using a basic substance. This inverted approach proves more effective because the basic substance selectively suppresses the polymerization mechanism triggered by conductive particles, achieving both stability improvement and unintended curing suppression.

Inventive Principle:

Principle #13The other way round (Inversion)

Solution Approach 2:

The invention changes the chemical parameter approach by switching from acidic stabilizers to a basic substance. This parameter change fundamentally alters how stability is achieved, using basicity to counteract the specific polymerization mechanism initiated by conductive particles, thereby suppressing unintended curing more effectively than acids.

Inventive Principle:

Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The use of a monocarboxylic acid with three or more carbon atoms effectively suppresses unintended curing, improving the stability and pot life of the resin composition, enabling the production of a paste for electronic components that includes 2-methylene-1,3-dicarbonyl compounds.

Implementation Method 1

a 2-methylene-1,3-dicarbonyl compound, such as methylene malonate, is cured by anionic polymerization using a basic substance as an initiator

Methodology Applied

Scientific EffectAnionic polymerization:

Data Source

PatentEP4079773B1Resin composition

Publication Date: 2024.09.25 NAMICS CORPORATION

AI summary

An object of the present invention is to provide a resin composition which suppresses the unintended curing of a 2-methylene-1,3-dicarbonyl compound in the presence of conductive particles to facilitate the production of a paste comprising the 2-methylene-1,3-dicarbonyl compound for electronic components. The resin composition of the present invention comprises (a) at least one 2-methylene-1,3-dicarbonyl compound, (b) at least one type of conductive particles and (c) at least one monocarboxylic acid with a number of carbon atoms of 3 or more.