Conductive Resin Protruding Electrodes for Thin Semiconductor Mounting
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Thin semiconductor chips with low dielectric materials are fragile and prone to cracking during mounting due to mechanical stress, and their crystal lattice can distort under heat, leading to fluctuations in transistor properties due to residual stress, necessitating the development of low-load protruding electrodes with consistent height for reliable external connection.
Innovation Solution
The use of conductive resin protruding electrodes formed through a photosensitive resin and conductive filler, where a liquid resin is selectively exposed using a photo mask with aligned liquid crystal cells to create electrodes with a truncated conical structure, allowing for flexible absorption of thermal and mechanical stress while maintaining consistent height and reducing mounting defects.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional mounting methods are used on thin semiconductor chips with low dielectric materials, then mounting can be completed, but the chips are prone to cracking and damage due to mechanical stress
Solution Approach 1:
The invention changes the physical and chemical parameters of the bonding material by using a photosensitive resin that can be cured from a liquid state to a solid state through light exposure. This allows the resin to flow and fill gaps in the liquid state, then harden to provide strong bonding in the solid state, thereby achieving reliable chip mounting without cracking
Solution Approach 2:
The invention uses a composite material system consisting of photosensitive resin combined with conductive filler particles. This composite provides both the mechanical bonding properties needed to avoid chip cracking and the electrical conductivity required for electrical connection, solving both mechanical strength and electrical connection requirements simultaneously
2Reliability
If heat is applied during mounting process, then bonding can be achieved, but crystal lattice distortion occurs leading to transistor property fluctuations
Solution Approach 1:
The invention replaces the thermal bonding mechanism with a photochemical bonding mechanism. Instead of using heat to cure the resin and achieve bonding, light exposure is used to initiate photopolymerization. This substitution eliminates the thermal stress that would cause crystal lattice distortion while still achieving reliable bonding and electrical connection
Solution Approach 2:
The invention changes the curing parameter from temperature-based (thermal) to light-based (photochemical). By using photosensitive resin that cures upon light exposure rather than heat treatment, the crystal lattice stability is maintained while still achieving the necessary bonding strength and electrical conductivity for reliable connections
3Quantity of substance
If external connection terminals are formed with smaller pitch, then storage density increases, but the terminals become more fragile and difficult to connect
Solution Approach 1:
The invention merges the electrical connection function and the mechanical bonding function into a single integrated protruding electrode structure. The conductive resin protruding electrodes simultaneously provide both the electrical pathway for signal transmission and the mechanical support for bonding, thereby ensuring connection reliability even for densely packed terminals with small pitch
Solution Approach 2:
The invention applies local quality by forming protruding electrodes only at the specific locations where external connection terminals are present. This localized approach ensures that each terminal receives adequate mechanical support and electrical connection without requiring the entire chip surface to be modified, thereby maintaining connection reliability for high-density terminal arrangements
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables the formation of highly reliable electronic part mounting structures with minimal connection defects, even on semiconductor elements with low mechanical strength, by absorbing stress and maintaining consistent electrode height, thus ensuring stable transistor properties and reliable connections.
Implementation Method 1
a liquid resin is selectively exposed using a photo mask with aligned liquid crystal cells to create electrodes
Data Source
AI summary
An electronic part mounting structure includes electronic part having a plurality of electrode terminals, a substrate provided with connection terminals in locations corresponding to these electrode terminals, and protruding electrode for connecting one of electrode terminals and one of connection terminals, where electrode terminal of electronic part and connection terminal of substrate are connected through protruding electrode and protruding electrode is formed of a conductive resin including a photosensitive resin and a conductive filler.