Conductive Resin Composition for Flexible Electronics
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Solution Overview
Problem
Conductive materials face challenges with flexibility, heat resistance, and resistance value changes when repeatedly contracted and expanded, limiting their use in wearable and deformable electronic devices.
Innovation Solution
A conductive composition incorporating an acrylic resin with specific polymer units, including (meth)acrylates with epoxy and isobornyl groups, combined with a conductive powder, which provides excellent conductivity, extensibility, and stable resistance values even under deformation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If a block copolymer or functional group-containing elastomer is used to provide extensibility, then flexibility is improved, but residual strain increases and resistance value changes when repeatedly contracted and expanded
Solution Approach 1:
The patent changes the chemical composition parameters of the elastomer by specifying precise proportions of polyether segments (30-70 mass%) and polyester segments (30-70 mass%), and by controlling the glass transition temperatures of different segments to resolve the contradiction between flexibility and resistance stability during repeated contraction and expansion
Solution Approach 2:
The patent uses a composite elastomer structure combining polyether segments and polyester segments with specific Tg ranges, where the polyether segment provides flexibility while the polyester segment reduces residual strain, thereby resolving the contradiction between extensibility and resistance value stability
2Adaptability or versatility
If conventional elastomers are used to achieve contraction and expansion properties, then extensibility is improved, but heat resistance deteriorates
Solution Approach 1:
The patent changes the thermal parameters by controlling the glass transition temperatures of different elastomer segments (polyether Tg: -100°C to -50°C, polyester Tg: -80°C to -20°C) and using specific segment compositions to achieve both contraction/expansion properties and heat resistance suitable for soldering processes
3Adaptability or versatility
If organic silicon compounds or certain resins are used to provide conductivity and flexibility, then extensibility is improved, but base material adhesion deteriorates
Solution Approach 1:
The patent changes the surface energy parameters by selecting specific elastomer compositions and controlling the resin composition (epoxy resin 10-50 mass%, polyester resin 30-70 mass%) to achieve appropriate surface free energy levels that improve base material adhesion while maintaining extensibility
Data Source
AI summary
A conductive composition is provided and at least includes an acrylic resin and a conductive powder, wherein the acrylic resin at least contains a polymer unit (A) of a (meth)acrylate having an epoxy group and a polymer unit (B) of a (meth)acrylate having an isobornyl group, and an amount of the polymer unit (B) is 5.0 parts by mass or more and 50.0 parts by mass or less based on 100 parts by mass of the acrylic resin.

