Conductive Resin Coating Composition for Flexible Low-Resistance Laminates

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Solution Overview

Problem

Conductive resin compositions used in electronic devices require higher conductivity, adhesiveness to flexible substrates, and stretchability to meet the demands of modern electronic devices.

Innovation Solution

A conductive resin composition comprising a thermoplastic resin binder, resin particles of the same type as the binder, and fibrous conductors such as carbon nanotubes or metal nanowires, with specific blending ratios to enhance adhesiveness and stretchability.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If conventional conductive resin composition is used, then basic conductivity is achieved, but resistance is high and conductivity is insufficient

Engineering Contradiction:
ImproveconductivityVSAvoidresistance
Core Design Contradiction:
ReliabilityVSObject-generated harmful factors

Solution Approach 1:

The patent uses a composite structure combining thermoplastic resin binder, resin particles of the same type, and fibrous conductors (carbon nanotubes or metal nanowires). This composite material approach creates a synergistic effect where the fibrous conductors form conductive networks within the resin matrix, significantly improving conductivity while reducing resistance compared to conventional conductive resin compositions.

Inventive Principle:
Principle #40Composite materials

2Reliability

If conductive resin composition is used with flexible substrate, then basic functionality is achieved, but adhesiveness is insufficient

Engineering Contradiction:
ImproveadhesivenessVSAvoidbonding strength to substrate
Core Design Contradiction:
ReliabilityVSStrength

Solution Approach 1:

The patent specifies that the resin particles must be of the same type as the thermoplastic resin binder, creating a homogeneous resin system. This parameter control ensures compatible molecular structures and bonding characteristics, enabling the coating to strongly adhere to flexible substrates. The specific blending ratio range (40-90 parts resin particles per 100 parts total resin) further optimizes adhesion by balancing resin continuity and conductor distribution.

Inventive Principle:
Principle #35Parameter changes

3Adaptability or versatility

If conductive resin composition is used for flexible electronics, then basic flexibility is achieved, but stretchability is insufficient

Engineering Contradiction:
ImprovestretchabilityVSAvoidstructural integrity during deformation
Core Design Contradiction:
Adaptability or versatilityVSStability of the object's composition

Solution Approach 1:

The patent employs a thermoplastic resin-based coating formulation that inherently provides flexibility and stretchability. The thermoplastic nature of the resin allows the coating to deform elastically with the flexible substrate, maintaining structural integrity during stretching and bending operations. This enables the conductive coating to function effectively in flexible electronic devices requiring repeated deformation.

Inventive Principle:
Principle #30Flexible shells and thin films

Data Source

PatentEP4663705A1Conductive resin composition, coating agent, and laminate
Publication Date: 2025.12.17 MITSUI CHEMICALS INC
  • EP4663705A1 patent drawingFigure 1A~1C
  • EP4663705A1 patent drawingFigure 2~3
  • EP4663705A1 patent drawing

AI summary

The conductive resin composition includes a thermoplastic resin binder, resin particles, and a fibrous conductor, and the thermoplastic resin binder and the resin of the resin particles are the same type of resin, and the fibrous conductor is a carbon nanotube and/or a metal nanowire.