Conductive Resin Layer Design for Electronic Component Stress and Moisture
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Solution Overview
Problem
Electronic components face issues with crack occurrence and moisture resistance due to external forces and infiltration, particularly when solder-mounted on devices, as existing configurations do not adequately address stress distribution and moisture pathways.
Innovation Solution
The electronic component design features a rectangular parallelepiped element body with internal conductors disposed in specific directions, a conductive resin layer covering parts of the principal, end, and side surfaces, and a sintered metal layer for reliable electrical connections, which reduces stress on the element body and minimizes moisture infiltration paths.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If the conductive resin layer covers the entire end surface, one part of each of the principal surfaces, and one part of each of the pair of side surfaces, then the external force is distributed, but the number of moisture infiltration paths increases
Solution Approach 1:
The conductive resin layer is segmented into two distinct regions: a first region that continuously covers the end surface and side surfaces for stress distribution, and a second region that covers only specific areas of the principal surfaces for electrical connection. This segmentation allows the different functions to be separated, reducing moisture infiltration paths while maintaining stress distribution capability.
Solution Approach 2:
Different regions of the conductive resin layer are assigned different coverage areas based on their functional requirements. The first region provides continuous coverage for mechanical strength, while the second region provides localized coverage for electrical connection, optimizing both stress distribution and moisture resistance.
2Object-affected harmful factors
If the conductive resin layer covers limited areas, then moisture infiltration paths are reduced, but external force distribution is insufficient
Solution Approach 1:
The conductive resin layer is divided into a first region for continuous coverage (covering the end surface and side surfaces) to ensure stress distribution, and a second region for selective coverage (covering only necessary areas of the principal surfaces) to minimize moisture infiltration paths.
Solution Approach 2:
The conductive resin layer performs multiple functions: the first region provides mechanical stress distribution and moisture protection, while the second region provides electrical connection. This multi-functionality allows the single layer to address both stress distribution and moisture resistance requirements.
3Reliability
If the element body is mounted on an electronic device, then electrical connection is achieved, but external force causes stress on the element body leading to cracks
Solution Approach 1:
The conductive resin layer acts as an intermediary between the element body and the external electronic device. It provides both electrical connection and mechanical stress distribution, absorbing and distributing external forces to prevent stress concentration and crack formation in the element body.
Solution Approach 2:
The conductive resin layer is composed of conductive particles embedded in a resin matrix, combining the electrical conductivity needed for connection with the flexibility and adhesion properties needed for stress distribution and protection.
Data Source
AI summary
An element body of a rectangular parallelepiped shape includes a first principal surface arranged to constitute a mounting surface, a second principal surface opposing the first principal surface in a first direction, a pair of side surfaces opposing each other in a second direction, and a pair of end surfaces opposing each other in a third direction. An external electrode is disposed at an end portion of the element body in the third direction. A first length of the element body in the first direction is different from a second length of the element body in the second direction. The external electrode includes a conductive resin layer. The conductive resin layer continuously covers one part of the first principal surface, one part of the end surface, and one part of each of the pair of side surfaces.