Conductive Resin Layer Voids Prevent Peel-Off
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Solution Overview
Problem
The conductive resin layer in electronic components can crack and peel off due to moisture absorption and subsequent gasification, leading to stress on the layer, which existing technologies fail to effectively control.
Innovation Solution
The electronic component design includes a conductive resin layer with specific thickness ratios and void area percentages on different regions, allowing gas generated from moisture absorption to be emitted outside through gaps, reducing stress on the resin layer and preventing peel-off.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the conductive resin layer is made thick to improve coverage and conductivity, then the electrical connection is improved, but the resin absorbs more moisture which leads to greater volume expansion and stress when gasified, causing crack and peel-off
Solution Approach 1:
The conductive resin layer is designed with a porous structure containing multiple voids (air pockets) distributed throughout its thickness. These voids allow moisture absorbed by the resin to gasify and escape without generating excessive stress, preventing crack and peel-off while maintaining adequate thickness for reliable electrical connection
Solution Approach 2:
The voids in the conductive resin layer act as intermediary spaces that mediate between the moisture absorbed by the resin and the external environment. They provide a controlled pathway for gas escape, reducing the direct stress transmission that would otherwise cause structural failure
2Object-affected harmful factors
If the conductive resin layer is made thin to reduce moisture absorption, then the gasification stress is reduced, but the electrical connection and coverage are insufficient
Solution Approach 1:
By introducing a porous structure with controlled void distribution, the resin layer can maintain adequate thickness for electrical connection while the voids reduce the effective moisture-holding capacity and provide stress relief pathways during gasification
3Ease of manufacture
If the resin layer is made uniform in thickness to simplify manufacturing, then the production process is easier, but the stress distribution during moisture gasification becomes uneven, leading to localized crack and peel-off
Solution Approach 1:
The conductive resin layer features locally varied properties: the void density and size are distributed non-uniformly through the thickness, with higher void concentration in regions experiencing greater stress during gasification. This local quality variation optimizes stress distribution while maintaining manufacturing feasibility
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design effectively controls the peel-off of the conductive resin layer by ensuring that gas generated from moisture absorption is emitted outside, thereby reducing stress and preventing cracking, while also minimizing moisture absorption and gas generation.
Implementation Method 1
The resin tends to absorb moisture
Implementation Method 2
the moisture absorbed by the resin may be gasified so that volume expansion may occur
Implementation Method 3
a plating layer covering the conductive resin layer
Data Source
AI summary
A conductive resin layer includes a first region positioned on the end surface, a second region positioned on the side surface, and a third region positioned on a ridge portion between the end surface and the side surface. In a case where a maximum thickness of the first region is T1 (μm) and a maximum thickness of the second region is T2 (μm), the maximum thickness T1 and the maximum thickness T2 satisfy a relation ofT2/T1≥0.11.In a cross-section along a thickness direction of the first region, a total area of voids in the first region is in a range of 5.0 to 36.0% of an area of the first region. In a cross-section along a thickness direction of the second region, a total area of voids in the second region is in the range of 5.0 to 36.0% of an area of the second region.