Conductive Resin Electronic Module Joints for Impact Stability
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Solution Overview
Problem
Existing electronic module structures using solder for joining electrodes are prone to positional deviation and creep deformation under impact, which is unsuitable for applications requiring high positional accuracy, and the high-temperature soldering process is not feasible for components with low heat resistance.
Innovation Solution
An electronic module design utilizing conductive resin portions and reinforcing resin portions to join electrodes, which are cured at lower temperatures, providing mechanical and electrical connections that resist impact and maintain positional stability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If solder is used to join electrodes, then electrical connection is achieved, but positional accuracy deteriorates due to creep phenomenon under impact
Solution Approach 1:
The patent changes the material parameter from solder to conductive resin, which fundamentally alters the joining mechanism from metallurgical bonding to adhesive bonding with conductive particles. This parameter change eliminates the creep phenomenon that occurs in solder under thermal and mechanical stress, thereby maintaining positional accuracy while still achieving reliable electrical connection.
Solution Approach 2:
The patent uses composite materials by incorporating conductive particles (such as metal粉末) into the resin matrix to create conductive resin. This composite structure combines the advantages of resin (low creep, good adhesion) with conductive particles (electrical conductivity), achieving both electrical connection and positional stability without the drawbacks of pure solder joints.
2Reliability
If high-temperature soldering process is adopted, then electrical connection is achieved, but component integrity deteriorates due to thermal stress on low heat resistance components
Solution Approach 1:
The patent changes the joining process parameter from high-temperature soldering to low-temperature conductive resin bonding. This parameter change reduces the peak temperature exposure from typically 200-300°C in soldering to below 150°C for resin curing, thereby protecting temperature-sensitive components from thermal damage while still achieving reliable electrical connection through the conductive resin.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design enhances the resistance to impact and maintains positional accuracy without using solder, allowing for reliable electrical connections and reduced thermal stress on components.
Implementation Method 1
a conductive resin portion including at least one first conductive resin portion joining the first electrode with the third electrode, and at least one second conductive resin portion joining the second electrode with the fourth electrode
Implementation Method 2
at least one reinforcing resin portion disposed between the at least one first conductive resin portion and the at least one second conductive resin portion, the at least one reinforcing resin portion joining the first principal surface of the electronic component with the second principal surface of the wiring board
Data Source
AI summary
An electronic module includes at least one electronic component including a first principal surface, first and second electrodes on the first principal surface, a wiring board including a second principal surface, third and fourth electrodes on the second principal surface, and a conductive resin portion. The conductive resin portion includes at least one first conductive resin portion joining the first and third electrodes, and at least one second conductive resin portion joining the second and fourth electrodes. The electronic module further includes at least one reinforcing resin portion that is disposed between at least one first and at least one second conductive resin portions and joins the first principal surface of the electronic component with the second principal surface of the wiring board.