Conductive Resin Particles for Low-Pressure Electrode Bonding
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Solution Overview
Problem
Conventional resin particles fail to ensure reliable electrical connection at low pressure and temperature due to insufficient contact and adhesion with conductive particles, leading to increased connection resistance and potential peeling, especially under impact or high humidity conditions.
Innovation Solution
A resin particle with specific thermal and compressive properties, characterized by an exothermic peak in differential scanning calorimetry and a compressive elasticity modulus difference, is used to enhance adhesion and impact resistance, allowing for effective contact and reduced connection resistance even at low pressure and temperature.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional resin particles are used for conductive particles, then the connection resistance increases and adhesion deteriorates, but the manufacturing process remains simple
Solution Approach 1:
The patent applies parameter changes by controlling the glass transition temperature (Tg) of the resin particle within a specific range of 50°C to 150°C. This parameter optimization enables the resin to provide adequate softness for conformal contact and adhesion while maintaining structural integrity, thereby reducing connection resistance without complicating the manufacturing process
Solution Approach 2:
The patent uses composite materials by combining the resin particle with a conductive layer to form a conductive particle. This composite structure allows the resin particle to provide mechanical support and adhesion while the conductive layer ensures electrical conductivity, resolving the contradiction between reliability and ease of manufacture
2Reliability
If high pressure and temperature are applied during thermocompression bonding, then electrical connection is improved, but distortion and display unevenness occur
Solution Approach 1:
The patent changes the temperature parameter by utilizing a resin particle with controlled glass transition temperature (50°C to 150°C). This allows thermocompression bonding to be performed at lower temperatures than conventional methods, achieving reliable electrical connection without causing distortion or display unevenness in the display device
Solution Approach 2:
The patent applies dynamics by utilizing the viscoelastic properties of the resin particle near its glass transition temperature. The resin exhibits enhanced deformability and conformability during bonding, enabling effective contact with electrodes at lower pressures and temperatures, thereby preventing distortion while ensuring good electrical connection
3Shape
If low pressure and temperature are used for thermocompression bonding, then distortion is reduced, but contact and adhesion are insufficient
Solution Approach 1:
The patent optimizes the glass transition temperature parameter of the resin particle to fall within 50°C to 150°C. This parameter setting ensures that at bonding temperatures within this range, the resin achieves optimal softness for conformal contact and strong adhesion, while preventing excessive deformation and distortion
Solution Approach 2:
The patent exploits the dynamic viscoelastic behavior of the resin particle near its glass transition temperature. The resin transitions between rigid and soft states, providing sufficient deformability for conformal contact with electrodes at low pressure while maintaining adhesion strength, thus resolving the contradiction between reduced distortion and adequate contact
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The resin particle ensures uniform contact and enhanced adhesion with conductive particles, reducing connection resistance and improving reliability under various conditions, including high humidity and impact.
Implementation Method 1
an exothermic peak is observed when differential scanning calorimetry is performed by heating the resin particle
Data Source
AI summary
Provided is a resin particle that can be uniformly brought into contact with an adherend, can effectively enhance adhesion to a conductive portion and impact resistance when electrodes are electrically connected to each other using a conductive particle having the conductive portion formed on a surface thereof, and further can effectively reduce connection resistance. In the resin particle according to the present invention, an exothermic peak is observed when differential scanning calorimetry is performed by heating the resin particle at a temperature rising rate of 5° C./min from 100° C. to 350° C. in an air atmosphere.