Thermally Conductive Resin Sheet Balancing Heat Transfer and Flexibility
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Solution Overview
Problem
Conventional heat-conducting resin sheets face challenges in achieving high thermal conductivity while maintaining flexibility, leading to potential stress-induced damage and installation difficulties in electronic devices due to increased hardness and stress when compressed.
Innovation Solution
A heat-conducting resin sheet comprising thermally conductive plate-shaped and spherical particles within specific volume ratios and compressive strength ranges, optimized for thermal conductivity and flexibility, with the particles dispersed in a resin to enhance heat dissipation and reduce stress during compression.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If the content of thermally conductive filler is increased to improve thermal conductivity, then thermal conductivity is improved, but the sheet becomes hard and flexibility deteriorates
Solution Approach 1:
The patent uses a composite filler system combining plate-shaped particles (boron nitride or aluminum nitride) with spherical particles (alumina or magnesium oxide) in specific volume ratios. This composite approach allows the plate-shaped particles to provide thermal conductivity pathways while the spherical particles act as spacers to prevent excessive hardening, thus maintaining flexibility even at high total filler content (30-90% by volume).
Solution Approach 2:
The patent assigns different functional roles to different filler shapes: plate-shaped particles primarily contribute to thermal conductivity through their high aspect ratio and stacking ability, while spherical particles primarily maintain flexibility and reduce stress concentration. This local functional differentiation resolves the contradiction between thermal conductivity and flexibility.
2Productivity
If the heat-conducting resin sheet is quickly compressed for automated installation, then installation efficiency is improved, but stress increases causing warp or damage to electronic components
Solution Approach 1:
The spherical particles are incorporated beforehand to act as cushioning elements that absorb and distribute compression stress during quick installation. These spherical fillers create a more compliant internal structure that prevents stress concentration on electronic components even when the sheet is rapidly compressed at high speeds.
Solution Approach 2:
The combination of plate-shaped and spherical particles creates a composite structure where the spherical particles serve as stress-absorbing elements during rapid compression, while the plate-shaped particles maintain thermal conductivity. This composite structure enables both high installation speed and low stress transmission to components.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides a resin sheet with excellent thermal conductivity and flexibility, effectively suppressing stress increases during quick compression, facilitating easier installation and efficient heat dissipation in electronic devices.
Implementation Method 1
a heat-conducting resin sheet including a thermally conductive plate-shaped particle, a thermally conductive spherical particle, and a resin
Data Source
AI summary
The heat-conducting resin sheet according to an aspect of the present invention comprises a thermally conductive plate-shaped particle, a thermally conductive spherical particle, and a resin, wherein the heat-conducting resin sheet has a thermal conductivity of 5 W/m·K or more and a 30% compressive strength B of 1500 kPa or less as measured at a compression rate of 1.0 mm/min. Furthermore, a volume ratio of the thermally conductive plate-shaped particle to the thermally conductive spherical particle (volume of thermally conductive plate-shaped particle/volume of thermally conductive spherical particle) is 30/70 to 90/10, and the total volume of the thermally conductive plate-shaped particle and the thermally conductive spherical particle is 30 to 90% by volume. According to the present invention, there can be provided a heat-conducting resin sheet that is excellent in the thermal conductivity and flexibility and can suppress the increase in the stress even when compressed quickly.