Conductive Resin Layer Layout for Smooth Semiconductor Surfaces

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Solution Overview

Problem

In semiconductor devices with a resin layer containing fibrous conductive fillers, the end sections of the fillers often protrude from the main surfaces of the resin layer, leading to reduced smoothness. This roughness affects the stacking of subsequent layers, such as insulating films and conductive films, and can lower the characteristics of the semiconductor element.

Innovation Solution

A semiconductor device is designed with a conductive resin layer that includes an insulating resin and fibrous conductive fillers. The layer is structured with a first surface layer section, an intermediate layer section, and a second surface layer section, where the fillers in the surface layer sections have directional angles relative to the main surface that are smaller than those in the intermediate layer section, enhancing smoothness.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If fibrous conductive fillers are dispersed in the resin layer to block electrical fields, then electrical field blocking capability is improved, but surface smoothness deteriorates due to protruding filler ends

Engineering Contradiction:

Improveelectrical field blocking capabilityVSAvoidsurface smoothness

Core Design Contradiction:

ReliabilityVSManufacturing precision

Solution Approach 1:

The patent applies local quality by creating distinct filler distribution patterns in different regions of the resin layer. The surface layer sections (within 30% thickness from each main surface) have fillers with smaller directional angles that align more parallel to the surface, while the intermediate layer has fillers with larger directional angles. This regional differentiation allows the surface to maintain smoothness while the bulk material provides electrical field blocking capability.

Inventive Principle:

Principle #3Local quality

Solution Approach 2:

The patent changes the directional angle parameter of fillers based on their position within the resin layer. By controlling the orientation parameter (directional angle relative to the main surface) to be smaller in surface layer sections and larger in the intermediate layer section, the invention achieves both smooth surfaces and effective electrical field blocking. This parameter variation resolves the contradiction between surface quality and functional performance.

Inventive Principle:

Principle #35Parameter changes

2Reliability

If fibrous conductive fillers are used in the resin layer, then conductivity and electrical field blocking are improved, but subsequent layer stacking quality deteriorates due to surface roughness

Engineering Contradiction:

Improveelectrical field blocking capabilityVSAvoidstacking quality of subsequent layers

Core Design Contradiction:

ReliabilityVSManufacturing precision

Solution Approach 1:

The invention applies local quality by creating distinct filler distribution patterns in different regions of the resin layer. The surface layer sections (within 30% thickness from each main surface) have fillers with smaller directional angles that align more parallel to the surface, while the intermediate layer has fillers with larger directional angles. This regional differentiation allows the surface to maintain smoothness while the bulk material provides electrical field blocking capability.

Inventive Principle:

Principle #3Local quality

Solution Approach 2:

Inventive Principle:

Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The approach results in a semiconductor device with highly-smooth main surfaces of the conductive resin layer, which in turn improves the smoothness and uniformity of subsequent layers, thereby maintaining the characteristics of the semiconductor element.

Implementation Method 1

a resin layer which is a flexible substrate (i.e., a substrate having flexibility) formed of resin and also including a semiconductor element have been proposed... a resin layer includes conductive fillers (i.e., micro conductors), seeking prevention of the lowering of characteristics of a semiconductor element by blocking an electrical field applied to the semiconductor element

Methodology Applied

Scientific EffectElectrical conduction: Conduction (electrical)

Implementation Method 2

The method includes forming the conductive resin layer by die coating using a die head

Methodology Applied

Scientific EffectDie coating: Deposition (physical)

Data Source

PatentUS12218243B2Semiconductor device, display apparatus, and manufacturing method of semiconductor device

Publication Date: 2025.02.04 MAGNOLIA BLUE CORP

AI summary

A semiconductor device includes a conductive resin layer that includes an insulating resin and first fillers dispersed in the insulating resin and has first and second main surfaces, and an element layer that is arranged on the first main surface and includes a semiconductor element. The first fillers are each a fibrous conductive filler. The conductive resin layer has a first surface layer section that includes the first main surface and has a thickness which is 30% of a thickness of the conductive resin layer, a second surface layer section that includes the second main surface and has a thickness which is 30% of the thickness of the conductive resin layer, and an intermediate layer section arranged between the first and second surface layer sections. First fillers have a smaller directional angle relative to the first main surface in the first surface layer section than in the intermediate layer section.