Conductive Sheath for Circuit Assembly Thermal Management
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Solution Overview
Problem
Conventional heat sink attachment methods for small electronic components, such as multi-chip modules, are inefficient due to trapped hot air, insufficient contact, and thermal interface material issues, leading to sub-optimal heat dissipation and electromagnetic interference shielding.
Innovation Solution
A conductive sheath with varying thicknesses and gaps is deposited on the components and substratum to provide effective heat dissipation and strain relief, while also functioning as an electromagnetic interference shield, using metal deposition and plating techniques to ensure optimal contact and expansion accommodation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If a metal cover is used to surround all components in the MCM for heat dissipation, then heat sink coverage is improved, but heat dissipation efficiency deteriorates due to trapped hot air inside the cover
Solution Approach 1:
The patent removes the enclosed metal cover structure and extracts only the essential heat dissipation function by depositing conductive material directly on components and substratum. This eliminates the trapped hot air problem while maintaining heat sink coverage through direct thermal contact paths.
2Object-affected harmful factors
If a metal cover is used to surround all components, then EMI shielding is improved, but shielding effectiveness deteriorates when components are exposed to EMI generated by other components inside the cover
Solution Approach 1:
The patent applies EMI shielding selectively only where needed by depositing conductive material on specific components and their immediate surroundings. This localized approach provides EMI protection for each component without creating an enclosed space that traps internal EMI, allowing each component to be shielded according to its specific EMI requirements.
3Ease of manufacture
If conventional heat sink attachment methods are used on small components, then manufacturing simplicity is improved, but heat dissipation effectiveness deteriorates due to insufficient contact
Solution Approach 1:
The patent merges the heat sink function directly with the component structure by depositing conductive material on the component surfaces and integrating it with the substratum. This eliminates separate attachment steps while ensuring reliable thermal contact through direct material continuity between the component, conductive material, and substratum.
4Device complexity
If uniform thickness conductive material is deposited on all surfaces, then manufacturing process simplicity is improved, but ability to accommodate thermal expansion deteriorates
Solution Approach 1:
The patent varies the thickness of the conductive material at different locations and orientations based on local thermal expansion requirements. The conductive material is deposited with greater thickness in regions experiencing higher thermal stress and reduced thickness in regions with lower expansion, providing localized adaptation to thermal effects while maintaining overall structural integrity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively counteracts deformation caused by thermal expansion and improves heat dissipation and EMI shielding, reducing warping and enhancing the operational efficiency of small electronic components.
Implementation Method 1
the conductive material in the third section has a transition from a first thickness to a second thickness that is smaller than the first thickness at an edge portion. The edge portion is configured to undergo deformation to counteract warping of the circuit assembly due to heat generated in at least the first flip-chip component
Implementation Method 2
The first section of the conductive sheath comprises a conductive material deposited upon at least a part of a top surface of the first flip-chip component
Data Source
AI summary
Illustrative systems and methods disclosed herein pertain to a circuit assembly having components mounted upon a substratum element. The components are encased in a conductive sheath that may be made of metal. The conductive sheath, which is operative as a heat sink and/or an EMI shield, is structurally constructed to counteract deformation of the substratum element when the one or more components heat up during operation, or due to ambient temperature changes. In one exemplary embodiment, the conductive sheath has different thickness at different locations. An edge portion located at a transition between a first thickness and a second thickness of the conductive sheath undergoes deformation that prevents warping of the circuit assembly due to heat. In another exemplary embodiment, the conductive sheath has a gap provided between adjacent segments. The gap allows room for thermal expansion and counteracts deformation of the circuit assembly caused by heating.