Thermally Conductive Sheet Structure for Stable Chip Heat Dissipation
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Solution Overview
Problem
Existing semiconductor devices face challenges in efficiently dissipating heat from semiconductor components, particularly due to the settling of thermally conductive powders or fillers in adhesive materials, which can degrade thermal conductivity.
Innovation Solution
A semiconductor device design that incorporates a thermally conductive sheet with a resin sheet having through-holes filled with a thermally conductive portion, which is interposed between the semiconductor chip and the heat dissipation member, enhancing thermal conduction in the thickness direction.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a thermally conductive adhesive material containing thermally conductive powder or filler is used, then thermal conduction is achieved, but thermal conductivity deteriorates due to settling of the powder or filler
Solution Approach 1:
The patent uses a porous foam body as the base material for the thermally conductive sheet. This porous structure allows filling with thermally conductive material while maintaining structural integrity. The foam body's cellular structure prevents settling of conductive particles by providing a rigid framework that holds the filling material in place, thus resolving the contradiction between achieving thermal conduction and maintaining composition stability.
Solution Approach 2:
The patent creates a composite structure by combining a foam body (providing structural support) with thermally conductive filling material (providing thermal conduction). This composite approach allows the foam matrix to prevent particle settling while the conductive filling maintains thermal pathways, simultaneously achieving both reliability of thermal conduction and stability of composition.
2Temperature
If thermally conductive powder or filler is used in adhesive material, then heat transfer is enabled, but thermal conduction efficiency decreases due to settling
Solution Approach 1:
The porous foam body provides a three-dimensional network structure that maintains fixed pathways for heat conduction. The cellular structure prevents collapse and settling that would otherwise disrupt thermal pathways, ensuring consistent heat dissipation efficiency over time while maintaining the ability to transfer heat effectively.
Solution Approach 2:
The foam body acts as an intermediary matrix that holds the thermally conductive filling material in a fixed position. This mediator structure prevents direct contact and settling of conductive particles with each other, maintaining stable thermal pathways from the heat generation body to the heat dissipation body, thus preserving thermal conduction efficiency.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design effectively secures efficient thermal conduction in the thickness direction, reducing the risk of thermal conductivity deterioration and ensuring reliable heat dissipation from semiconductor components.
Implementation Method 1
heat is transferred by contact of the thermally conductive powder or the filler
Data Source
AI summary
A semiconductor device including: a semiconductor component including a semiconductor chip; a heat dissipation member; and a thermally conductive sheet interposed between the semiconductor component and the heat dissipation member. The thermally conductive sheet includes a resin sheet having a through-hole, and a thermally conductive portion filled in the through-hole. The thermally conductive sheet and the heat dissipation member may be provided on a side opposite to a circuit surface of the semiconductor chip. The heat dissipation member may be a heat spreader or a heat sink.