Thermally Conductive Sheet with Silicon Compound Matrix
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Solution Overview
Problem
The increasing heat generation in miniaturized electronic equipment requires thermally conductive sheets to exhibit higher thermal conductivity to efficiently transfer heat from heat-generating bodies to heat-dissipating bodies.
Innovation Solution
A thermally conductive sheet comprising a crosslinked organopolysiloxane matrix with graphitized carbon fibers and silicon compounds, such as alkoxysilane or alkoxysiloxane, where the silicon compound content is between 0.1% to 50% by mass, enhancing thermal conductivity while maintaining moldability and heat resistance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If the thermal conductivity is increased to meet the heat dissipation requirements of miniaturized electronic equipment, then the heat transfer efficiency is improved, but the moldability and manufacturing precision deteriorate
Solution Approach 1:
The patent changes the chemical composition parameters of the matrix by introducing specific silicon compounds (alkoxysilane or alkoxysiloxane) at controlled proportions (0.1-50% by mass). This compositional parameter change enables the matrix to achieve both high thermal conductivity and good moldability, resolving the contradiction between thermal performance and manufacturing quality
Solution Approach 2:
The patent creates a composite matrix system combining organopolysiloxane with silicon compounds and graphitized carbon fibers. This composite material approach allows the synergistic combination of different material properties: the organopolysiloxane provides base matrix properties, the silicon compounds enhance thermal conductivity and crosslinking, and the carbon fibers provide additional thermal pathways while maintaining processability
2Temperature
If the content of silicon compound is increased to improve thermal conductivity, then the heat dissipation performance is enhanced, but the cost and material complexity increase
Solution Approach 1:
The patent establishes an optimal parameter range for silicon compound content (0.1-50% by mass) that balances thermal conductivity enhancement with material simplicity. Within this range, the silicon compounds provide sufficient thermal improvement without requiring complex multi-component formulations or excessive material quantities
Solution Approach 2:
The patent applies silicon compounds locally at the molecular level within the matrix structure, where they participate in crosslinking reactions and form thermal conduction pathways. This localized application at the chemical structure level achieves high thermal conductivity without requiring uniform distribution of complex materials throughout the entire composition
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution achieves higher thermal conductivity, improved moldability, and reduced thermal resistance, ensuring effective heat transfer and long-term stability of the thermally conductive sheet.
Implementation Method 1
a thermally conductive sheet to be disposed between a heat-generating body and a heat-dissipating body... a thermally conductive filler comprising a graphitized carbon fiber dispersed in the matrix
Implementation Method 2
at least one silicon compound selected from the group consisting of alkoxysilane compounds and alkoxysiloxane compounds... an organopolysiloxane having a crosslinked structure
Implementation Method 3
alkoxysilane compounds and alkoxysiloxane compounds... crosslinked structure
Data Source
Figure 1
AI summary
A thermally conductive sheet contains a matrix composed of an organopolysiloxane having a crosslinked structure, a thermally conductive filler dispersed in the matrix, and a silicon compound. The silicon compound is at least one selected from the group consisting of alkoxysilane compounds and alkoxysiloxane compounds.