Conductive Shield for Semiconductor Package EMI and Thermal Management
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional semiconductor packaging techniques face challenges in providing effective electromagnetic interference (EMI) shielding and thermal dissipation as semiconductor packages become smaller and operate at higher speeds, compromising their reliability.
Innovation Solution
A manufacturing method involving the formation of conductive connectors, a redistribution layer, and a conductive shield around the die to provide EMI shielding and thermal dissipation, with the conductive shield being electrically insulated from the die and connected to the redistribution layer to enhance shielding effectiveness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If conventional packaging techniques are used to reduce package size and increase operation speed, then product miniaturization and higher operation speed are achieved, but EMI shielding and thermal dissipation capabilities deteriorate
Solution Approach 1:
The patent segments the packaging structure into multiple functional layers including a substrate, a first insulating layer, a conductive shield layer, and a second insulating layer. This segmentation allows each layer to perform its specific function (structural support, electrical insulation, EMI shielding, thermal dissipation) independently, maintaining reliability while enabling miniaturization.
Solution Approach 2:
The conductive shield is nested within the package structure between the die and the substrate, surrounded by insulating layers. This nested configuration provides EMI shielding and thermal dissipation without increasing the overall package volume, as the shield is integrated within the existing structural layers rather than adding external components.
2Volume of moving object
If package size is reduced to achieve miniaturization, then smaller volume products are developed, but EMI shielding effectiveness and thermal dissipation are compromised
Solution Approach 1:
The patent introduces a conductive shield as an intermediary element between the die and the substrate. This shield acts as a mediator that blocks electromagnetic interference from reaching the die while also providing a thermal conduction path. The insulating layers serve as intermediaries to electrically isolate the conductive shield from the die, allowing the shield to perform its shielding function without creating electrical interference.
Solution Approach 2:
The package structure employs composite material layers including conductive materials for the shield (such as copper or aluminum) and insulating materials (such as epoxy resin or ceramic) for the insulating layers. This composite approach allows simultaneous achievement of EMI shielding, thermal dissipation, and electrical insulation within a compact structure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method achieves enhanced EMI shielding and thermal dissipation without compromising the reliability of the package structure, simplifying the design and enabling miniaturization while protecting the die from electromagnetic interference and heat.
Implementation Method 1
A conductive shield is formed on the redistribution layer to surround the second conductive connector and at least a portion of a sidewall of the die coupled the active surface. The die is electrically insulated from the conductive shield.
Implementation Method 2
since the conductive shield is connected to the redistribution layer and surrounds the die, it may provide the EMI shielding function in the package structure and the chip structure. As such, the package structure and the chip structure may achieve the enhanced EMI shielding effectiveness and thermal dissipation
Data Source
AI summary
A manufacturing method of a package structure including the following steps is provided. A plurality of first conductive connectors and a second conductive connector on an active surface of a die are formed. The first conductive connectors are electrically connected to the die. The second conductive connector is formed aside the first conductive connectors and electrically insulated to the die. A redistribution layer is formed on the die. The redistribution layer is electrically connected to the first conductive connectors and the second conductive connector. A conductive shield is formed on the redistribution layer to surround the second conductive connector and at least a portion of a sidewall of the die coupled the active surface. The die is electrically insulated from the conductive shield. Another manufacturing method of a package structure is also provided.