Conductive Shield for EMI and Thermal Management in Semiconductor Packages
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Solution Overview
Problem
Conventional semiconductor packaging techniques face challenges in providing effective electromagnetic interference (EMI) shielding and thermal dissipation as operation speed increases and package size decreases, compromising the reliability of semiconductor packages.
Innovation Solution
A package structure and chip structure are designed with a conductive shield connected to a redistribution layer, surrounding the die, to provide EMI shielding and thermal dissipation, while maintaining the reliability of the structure through electrical insulation and a specific arrangement of conductive connectors and pads.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If conventional packaging techniques are used, then device size can be reduced, but EMI shielding capability deteriorates
Solution Approach 1:
The conductive shield is integrated within the package structure, nesting the EMI shielding function inside the existing package volume without requiring external additions. The shield is positioned between the die and the package substrate, utilizing the internal space efficiently to provide EMI protection while maintaining compact dimensions.
Solution Approach 2:
The conductive shield serves multiple functions simultaneously: it provides EMI shielding, acts as a thermal management component, and serves as an electrical connection element through its connection to the redistribution layer. This multi-functionality allows a single structure to address multiple challenges in miniaturized packages.
2Volume of moving object
If conventional packaging techniques are used, then device size can be reduced, but thermal dissipation capability deteriorates
Solution Approach 1:
The thermal management function is nested within the package structure through the conductive shield, which is positioned internally to provide thermal pathways without increasing external dimensions. The shield creates thermal conduction paths from the die to the package substrate.
Solution Approach 2:
The conductive shield acts as an intermediary thermal conduction path between the die and the package substrate. It mediates heat transfer from the heat-generating die to the larger thermal mass of the substrate, improving thermal management in the miniaturized structure.
3Object-affected harmful factors
If EMI shielding structure is added, then EMI shielding effectiveness is improved, but device complexity increases
Solution Approach 1:
The conductive shield is designed to perform multiple functions within a single structural element: EMI shielding, thermal management, and electrical connection. This integration reduces the need for separate components, thereby limiting the increase in device complexity while achieving improved EMI protection.
Solution Approach 2:
The EMI shielding function is merged with existing structural and electrical components of the package. The conductive shield is integrated with the redistribution layer and positioned within the existing package architecture, combining shielding functionality with structural support and electrical interconnection rather than adding a completely separate system.
4Object-affected harmful factors
If conductive shield is added for EMI shielding, then EMI shielding effectiveness is improved, but manufacturing complexity increases
Solution Approach 1:
The conductive shield is formed as part of the redistribution layer structure during the existing manufacturing process sequence. By integrating the shield formation into the established redistribution layer fabrication steps, the patent avoids adding separate manufacturing operations, thereby limiting the increase in manufacturing complexity while achieving EMI shielding.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively enhances EMI shielding and thermal dissipation without impacting the reliability of the semiconductor package, achieving miniaturization and improved performance.
Implementation Method 1
The conductive shield is coupled to the redistribution layer and surrounds the second conductive connector and at least a portion of the sidewall
Implementation Method 2
The conductive shield is coupled to the redistribution layer and surrounds the second conductive connector and at least a portion of the sidewall
Data Source
AI summary
A package structure including a die, a plurality of first conductive connectors, a second conductive connector electrically insulated from the die, a redistribution layer and a conductive shield is provided. The die includes an active surface, a back surface opposite the active surface, and a sidewall coupling the active surface to the back surface. The first conductive connectors are disposed on the active surface of the die and electrically connected to the die. The second conductive connector is disposed on the die and aside the first conductive connectors. The redistribution layer is disposed on the die and electrically connected to the first conductive connectors and the second conductive connector. The conductive shield coupled to the redistribution layer surrounds the second conductive connector and at least a portion of the sidewall. The die is electrically insulated to the conductive shield. A chip package structure is also provided.