Conductive Shield Layer in Stacked IC Package
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Solution Overview
Problem
In multi-chip device packages, signals from one integrated circuit (IC) often interfere with the operation of another IC due to close proximity, leading to issues like clock signal leakage, which degrades receiver performance, especially in RF communication devices.
Innovation Solution
A multi-layer interconnection circuit is used where one layer serves as a conductive shield to reduce interference between ICs, fabricated as part of the IC package using a process like copper interconnects, ensuring the shield is integral and effective in suppressing signal radiation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If multiple ICs are packaged in close proximity in a multi-chip package, then device integration and size are improved, but signal interference between ICs increases
Solution Approach 1:
The device package is segmented into multiple functional zones by introducing a conductive spacer structure that physically divides the package into first and second regions. This segmentation allows closely packed ICs to be electrically isolated while maintaining compact physical dimensions, thus resolving the contradiction between small device size and signal interference prevention.
Solution Approach 2:
A conductive spacer structure serves as an intermediary element between adjacent ICs in the multi-chip package. This spacer acts as a shield that blocks electromagnetic signals from one IC from interfering with another, enabling close proximity packaging while maintaining signal integrity through the mediating protective structure.
2Object-affected harmful factors
If a conductive spacer structure is added between ICs to reduce interference, then signal interference is reduced, but device complexity and manufacturing steps increase
Solution Approach 1:
The conductive spacer structure is merged with the underfill material that is already necessary for mechanical support and stress relief in multi-chip packages. By combining the shielding function with the structural underfill function, the patent reduces overall device complexity while maintaining interference reduction benefits.
Solution Approach 2:
The underfill material is given multiple functions: it provides mechanical support, stress relief, and electrical shielding through the integrated conductive spacer structure. This multi-functionality reduces the need for separate components, thereby simplifying the overall package structure despite adding shielding capabilities.
3Object-affected harmful factors
If a conductive spacer structure with filler is used for shielding, then interference reduction is improved, but manufacturing complexity and process steps increase
Solution Approach 1:
The conductive spacer structure is prepared in advance as a pre-fabricated component with the desired conductive pattern and filler material already in place. This preliminary preparation allows for simpler integration during the assembly process, as the spacer can be directly placed and encapsulated without requiring complex in-situ fabrication steps.
Solution Approach 2:
The conductive spacer structure is designed to be self-supporting and self-aligning during the encapsulation process. The structure's own geometry and material properties enable it to maintain its shielding function without requiring additional alignment fixtures or complex positioning procedures, thereby simplifying manufacturing.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach effectively reduces interference between ICs, maintaining performance stability across varying conditions, is cost-effective, and simplifies manufacturing, while being more efficient than external separators, ensuring predictable and high suppression of signal interference.
Implementation Method 1
a selected layer in the plurality is configured to serve as a conductive shield for reducing interference between the first and second ICs
Data Source
AI summary
An apparatus includes a device package, a first Integrated Circuit (IC) that is packaged in the device package, and a second IC, which is packaged in the device package and is fabricated on a multi-layer interconnection circuit including a plurality of interconnection layers for interconnecting components of the second IC, wherein a selected layer in the plurality is configured to serve as a conductive shield for reducing interference between the first and second ICs.