Conductive Shielding Structure for Die Embedded in Package Substrate
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Solution Overview
Problem
Integrated circuits lack effective heat dissipation and electromagnetic interference (EMI) shielding mechanisms, leading to potential damage from heat and electromagnetic fields, which can cause warping and stress on solder joints.
Innovation Solution
A conductive structure is formed within the package substrate to surround the inactive sides of the die, coupled to a grounding plane or chassis, using materials like copper or conductive polymers, providing heat dissipation and EMI shielding while enhancing structural stability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the die is mounted in a protective housing without additional shielding mechanisms, then the device structure is simple, but the die is vulnerable to heat damage and electromagnetic interference
Solution Approach 1:
The patent combines multiple functions into the conductive structure: it serves as both a mechanical support element and an EMI shield, while also providing thermal management. This merging of functions reduces the need for separate shielding components, thereby improving protection without proportionally increasing complexity
Solution Approach 2:
The conductive structure performs multiple roles simultaneously: it provides structural support to hold the die, acts as an electromagnetic interference shield through its conductive material, and facilitates heat dissipation from the die. This multi-functionality addresses the contradiction by delivering comprehensive protection without requiring separate dedicated components for each function
2Temperature
If no heat dissipation mechanism is provided, then the device structure remains simple, but heat accumulates causing warping and stress on solder joints
Solution Approach 1:
The conductive structure acts as an intermediary thermal management system between the die and the surrounding environment. It provides a dedicated thermal pathway that conducts heat away from the die without requiring complex active cooling systems, thereby managing temperature while maintaining structural integrity
Solution Approach 2:
The patent utilizes the thermal conductivity parameter of the conductive structure to manage heat flow. By selecting materials with appropriate thermal conductivity and designing the structure's geometry, the system changes the thermal parameters to facilitate heat dissipation, preventing temperature-induced warping and stress
3Object-affected harmful factors
If the die is embedded without EMI shielding, then manufacturing is simpler, but electromagnetic fields cause interference and potential damage
Solution Approach 1:
The EMI shielding function is segmented into a specific conductive structure component rather than requiring comprehensive shielding throughout the entire package. This targeted approach provides effective EMI protection for the die while keeping the manufacturing process simpler than complete package shielding would require
4Reliability
If a conductive structure is added for heat dissipation and EMI shielding, then protection and thermal management improve, but device complexity increases
Solution Approach 1:
The conductive structure merges multiple protective and functional roles into a single integrated component, providing structural support, EMI shielding, and thermal management simultaneously. This consolidation improves reliability across multiple parameters without requiring separate components for each function, thereby limiting the increase in overall device complexity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively reduces heat-related stress and electromagnetic interference, enhancing the robustness and stability of the integrated circuit package by dissipating heat and shielding electromagnetic fields, thus improving the structural integrity and performance of the circuit.
Implementation Method 1
A conductive structure is formed within the package substrate to surround the inactive sides of the die... providing heat dissipation
Implementation Method 2
A conductive structure is formed within the package substrate to surround the inactive sides of the die... surrounding electromagnetic fields... coupled to a grounding plane or chassis
Data Source
AI summary
A package that includes an integrated device partially enclosed in a conductive material and embedded in a package substrate. The package includes a package substrate having a first cavity, the integrated device having a first active side and an inactive side embedded in the first cavity, and a structure partially enclosing the integrated device having a first layer and a second layer, wherein the first layer is coupled between the package substrate and the integrated device, and wherein the second layer is disposed over the inactive side of the integrated device.