Conductive Shielding Structure for EMI Blocking During Molding
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Solution Overview
Problem
Current electronic devices face challenges in effectively addressing electromagnetic interference (EMI) due to limitations in shielding structures, such as metal lids that restrict component height and vertically oriented metal wires that can be disrupted during molding processes, leading to decreased shielding effectiveness.
Innovation Solution
The electronic device incorporates a shielding structure with a supporting element, an absorbable element, and a connection element, where the connection element protrudes above the absorbable element, allowing for secure attachment to a shielding layer without height restrictions and maintaining verticality during molding, thus enhancing EMI blocking capabilities.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If metal lids with eaves are used for shielding, then electromagnetic interference is blocked, but the height of electronic components is limited
Solution Approach 1:
The shielding structure is divided into multiple functional segments: a supporting element (vertical portion) that provides EMI shielding, an absorbable element (such as wax or photoresist) that enables selective removal, and a connection element that ensures electrical connectivity. This segmentation allows the shielding function to be separated from the height-limiting eaves structure, enabling taller components while maintaining EMI protection.
2Object-affected harmful factors
If vertical metal wires are used for shielding, then electromagnetic interference is blocked, but the wires are tilted or swept away during molding process
Solution Approach 1:
The absorbable element is placed at the base of the shielding structure before the molding process. During molding, this element is selectively removed (absorbed) by a nozzle, creating a support-free zone that allows the shielding structure to be properly positioned and secured to the shielding layer without being disrupted by mold flow. This preliminary placement and subsequent removal prevents the tilting and displacement issues that occur with traditional vertical wire structures.
Solution Approach 2:
The absorbable element acts as an intermediary that facilitates the positioning and securing of the shielding structure. By being selectively removed during molding, it mediates between the mold flow and the shielding structure, allowing the shielding element to maintain its vertical orientation and connect properly to the shielding layer without being swept away by the molding process.
3Object-affected harmful factors
If traditional shielding structures are used, then EMI blocking is achieved, but manufacturing complexity increases due to precision requirements
Solution Approach 1:
The absorbable element is designed as a temporary, disposable component made from inexpensive materials such as wax, photoresist, or other moldable substances. This element is placed during assembly, performs its function of enabling precise positioning and connection during molding, and then is selectively removed. Using such temporary, low-cost elements simplifies the overall manufacturing process by reducing precision requirements for permanent components while still achieving the desired shielding performance.
Data Source
AI summary
An electronic device and a method for manufacturing the same are provided. The electronic device includes a first electronic component, a second electronic component and a conductive element. The conductive element includes a first portion and a second portion. The first portion is configured to block an electromagnetic interference between the first electronic component and the second electronic component. The second portion protrudes from the first portion and contacts a shielding layer.