Conductive Shielding Structure for SiP EMI and Heat Dissipation
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Solution Overview
Problem
Semiconductor devices, particularly in high-frequency applications, face challenges with electromagnetic interference (EMI) and heat dissipation due to the integration of high-speed digital and RF electrical components, which can interfere with neighboring devices and generate heat, necessitating improved shielding and heat management in SiP modules and antenna integration.
Innovation Solution
A conductive structure is formed using electromagnetic shielding material and a heat sink to integrate RF antennas and SiP modules, providing EMI shielding and heat dissipation through conductive posts or frames, which are grounded to dissipate heat and reduce warpage, while maintaining reduced interface pitches and higher pin-counts.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If electromagnetic shielding material is conformally applied over the encapsulant, then EMI shielding is improved, but device complexity and manufacturing complexity increase
Solution Approach 1:
The patent combines the EMI shielding function with the heat dissipation function into a single integrated conductive structure. The conductive shielding material is applied to the bottom surface of the encapsulant and electrically connected to ground, while simultaneously serving as a heat dissipation path. This merging eliminates the need for separate shielding layers and simplifies the overall device structure.
Solution Approach 2:
The conductive structure performs multiple functions simultaneously: it provides EMI shielding by blocking electromagnetic interference, dissipates heat from the semiconductor die through thermal conduction, and provides mechanical support. This multi-functionality reduces the number of components needed and simplifies the device architecture.
2Productivity
If high-speed digital and RF electrical components are integrated for small size and low height, then productivity and functionality are improved, but heat generation increases
Solution Approach 1:
The patent introduces a thermal interface material as an intermediary between the semiconductor die and the conductive shielding structure. This thermal interface material enhances heat transfer from the die to the shielding structure, which acts as a heat sink. The intermediary material ensures efficient thermal coupling while maintaining electrical isolation where needed.
Solution Approach 2:
The patent extracts the heat dissipation function from the traditional cooling solutions and integrates it into the EMI shielding structure itself. By making the shielding material conductive and thermally coupled to ground, the shielding structure is 'taken out' from being merely a protective layer and transformed into an active heat dissipation component.
3Adaptability or versatility
If interface pitch is reduced and pin-count is increased, then functionality is improved, but heat generation and EMI increase
Solution Approach 1:
The patent merges the EMI shielding function with heat dissipation into a single conductive structure at the bottom of the encapsulant. This integrated approach addresses both heat and EMI issues simultaneously, enabling higher integration density and pin-count without proportionally increasing heat and EMI problems.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively reduces EMI and heat generation, enabling higher functionality and reliability in semiconductor devices by integrating RF antennas and SiP modules with improved heat dissipation and structural integrity, suitable for applications like 5G cellular.
Implementation Method 1
A conductive structure is formed using electromagnetic shielding material and a heat sink to integrate RF antennas and SiP modules, providing EMI shielding and heat dissipation through conductive posts or frames
Implementation Method 2
An electromagnetic shielding material is commonly conformally applied over the encapsulant. The electromagnetic shielding material reduces or inhibits EMI, RFI, and other inter-device interference
Data Source
AI summary
A semiconductor device has an antenna substrate and a component module disposed over the antenna substrate. The component module includes an electrical component, and a conductive structure formed around the electrical component. Alternatively, an electrical component can be disposed over the antenna substrate, and a conductive structure is disposed over the antenna substrate and around the electrical component. An encapsulant is deposited around the electrical component and conductive structure. A shielding material is formed over the component module, and a heat sink formed over the component module. The shielding material can be formed over the component module, while the heat sink is formed over the shielding material. Alternatively, the heat sink is formed over the component module, while the shielding material is formed over the heat sink. The conductive structure has a plurality of posts or a frame. A thermal interface material is disposed over the component module.