Conductive Shielding Structure for EMI and Heat in SiP Modules
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Solution Overview
Problem
Semiconductor devices, particularly in high-frequency applications, face challenges with electromagnetic interference (EMI) and heat dissipation due to the integration of high-speed digital and RF electrical components, which can interfere with neighboring devices and generate heat during operation, requiring improved shielding and heat dissipation solutions.
Innovation Solution
A conductive structure is formed using electromagnetic shielding material and a heat sink integrated with the semiconductor device, which includes conductive posts or frames for grounding and heat dissipation, along with a RF antenna substrate for improved signal transmission and reception, addressing EMI and heat generation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If high-speed digital and RF electrical components are integrated into a SiP module for small size and low height, then device density and functionality are improved, but electromagnetic interference and heat generation increase
Solution Approach 1:
The patent divides the SiP module into distinct functional regions with electromagnetic shielding material strategically placed between high-speed digital components and RF components. This segmentation isolates interfering components, allowing high device density while reducing electromagnetic interference through spatial separation and targeted shielding.
Solution Approach 2:
The patent introduces electromagnetic shielding material as an intermediary element between conflicting components. This shielding material acts as a mediator that blocks electromagnetic fields, enabling close integration of components without allowing interference, thus maintaining high productivity while eliminating harmful effects.
2Object-affected harmful factors
If electromagnetic shielding material is conformally applied over the encapsulant, then EMI shielding is improved, but device thickness increases
Solution Approach 1:
The patent applies electromagnetic shielding material selectively in specific locations where interference occurs, rather than uniformly throughout the entire device. The shielding is concentrated in critical areas between digital and RF components, providing effective EMI protection while minimizing overall thickness increase through localized rather than global application.
Solution Approach 2:
The patent implements partial shielding by applying electromagnetic shielding material only where necessary to block interference paths, rather than enclosing the entire device. This partial action approach provides sufficient EMI protection for critical components while avoiding the excessive thickness that would result from complete encapsulation in shielding material.
3Adaptability or versatility
If interface pin-count is increased for higher functionality, then device capability is improved, but heat generation and warpage increase
Solution Approach 1:
The patent segments the interface structure into multiple regions with distributed heat dissipation pathways. The substrate and encapsulant are designed with thermal management features at different locations, allowing high pin-count interfaces while distributing heat generation across multiple escape routes, preventing localized overheating and warpage.
Solution Approach 2:
The patent introduces thermal management materials and structures as intermediaries between the high-pin-count interface and the device body. These intermediary elements facilitate heat transfer from the interface region, enabling high pin-count connectivity while managing the thermal load through dedicated heat dissipation pathways.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The integrated shielding and heat dissipation structure effectively reduces EMI and heat, enabling reduced interface pitches, higher pin-counts, and thinner package technology, while maintaining operational stability and reducing warpage.
Implementation Method 1
heat sink integrated with the semiconductor device... for heat dissipation
Implementation Method 2
An electromagnetic shielding material is commonly conformally applied over the encapsulant. The electromagnetic shielding material reduces or inhibits EMI, RFI, and other inter-device interference
Data Source
AI summary
A semiconductor device has an antenna substrate and a component module disposed over the antenna substrate. The component module includes an electrical component, and a conductive structure formed around the electrical component. Alternatively, an electrical component can be disposed over the antenna substrate, and a conductive structure is disposed over the antenna substrate and around the electrical component. An encapsulant is deposited around the electrical component and conductive structure. A shielding material is formed over the component module, and a heat sink formed over the component module. The shielding material can be formed over the component module, while the heat sink is formed over the shielding material. Alternatively, the heat sink is formed over the component module, while the shielding material is formed over the heat sink. The conductive structure has a plurality of posts or a frame. A thermal interface material is disposed over the component module.