Thermally Conductive Shock Absorbers for Passive Cooling in Rugged Electronics

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Solution Overview

Problem

Rugged electronic devices face thermal management challenges due to increased thickness in their chassis, which reduces the effectiveness of passive cooling systems, often necessitating the use of costly active cooling systems to prevent overheating.

Innovation Solution

Integration of a thermally conductive shock absorber that combines passive cooling with impact resistance by using a shock absorbing material and a thermal conductive material to create a heat transfer pathway between electronic components and the outer skin of the device, allowing for efficient heat dissipation while protecting against mechanical impacts.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Strength

If the chassis thickness is increased to provide impact resistance, then mechanical strength is improved, but thermal management effectiveness deteriorates

Engineering Contradiction:
Improvemechanical strengthVSAvoidthermal management effectiveness
Core Design Contradiction:
StrengthVSTemperature

Solution Approach 1:

The patent combines the shock absorber function with the thermal management function into a single integrated component. The shock absorber is constructed with thermally conductive material that creates a thermal pathway from the electronic component to the chassis, allowing it to simultaneously provide mechanical impact protection and thermal conduction for passive cooling.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The shock absorber utilizes composite material construction, specifically using thermally conductive materials (such as graphite or metal) within the shock absorber structure. This composite approach enables the material to exhibit both shock-absorbing mechanical properties and high thermal conductivity, resolving the contradiction between mechanical strength and thermal management.

Inventive Principle:
Principle #40Composite materials

2Ease of manufacture

If passive cooling systems are used to reduce costs, then manufacturing cost is improved, but thermal management effectiveness deteriorates due to chassis thickness

Engineering Contradiction:
Improvemanufacturing costVSAvoidthermal management effectiveness
Core Design Contradiction:
Ease of manufactureVSTemperature

Solution Approach 1:

The patent merges the shock absorption function with the thermal conduction function in a single component. By making the shock absorber itself thermally conductive, the system maintains passive cooling effectiveness despite the thick chassis, avoiding the need for expensive active cooling systems while preserving thermal management performance.

Inventive Principle:
Principle #5Merging (Combining)

3Temperature

If active cooling systems are used to improve thermal management, then temperature control is improved, but device complexity and cost increase

Engineering Contradiction:
Improvetemperature controlVSAvoiddevice complexity
Core Design Contradiction:
TemperatureVSDevice complexity

Solution Approach 1:

The thermally conductive shock absorber enables self-service passive cooling by creating an inherent thermal pathway through its conductive material structure. The system utilizes natural heat conduction through the shock absorber from the electronic component to the chassis without requiring external power sources, control systems, or active cooling mechanisms, thereby maintaining simplicity while achieving effective temperature control.

Inventive Principle:
Principle #25Self-service

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution provides effective passive cooling and impact resistance, reducing manufacturing costs and improving device performance by maintaining optimal temperatures and reducing acoustic noise associated with active cooling systems.

Implementation Method 1

a thermal conductive material to transfer heat from the electronic component to the outer skin

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

a shock absorbing material and a thermal conductive material to create a heat transfer pathway

Methodology Applied
Scientific EffectShock absorption: Damping

Data Source

PatentUS12082378B2Thermally conductive shock absorbers for electronic devices
Publication Date: 2024.09.03 INTEL CORP
  • US12082378B2 patent drawing
  • US12082378B2 patent drawing
  • US12082378B2 patent drawing

AI summary

Thermally conductive shock absorbers for electronic devices are disclosed. An electronic device includes a housing and a hardware component positioned inside the housing. A thermally conductive shock absorber is located between an inner surface of the housing and the hardware component. The thermally conductive shock absorber including an impact absorbing material and a thermal conductive material being in contact with at least a portion of the impact absorbing material.