Conductive Silicon Camera Module With Integrated LED Cavities
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Solution Overview
Problem
The existing LED packaging technology used in mobile camera devices is outdated and inefficient, occupying excessive space and requiring separate mounting structures, which hinders the compact integration of camera and LED units.
Innovation Solution
A camera module is developed using a conductive silicon substrate with integrated cavities to house both the image sensor and LED devices, enabling closer proximity and alignment, and utilizing wafer level technology for space savings and electrical connectivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If separate LED unit with flex PCB connector is used, then electrical connectivity is achieved, but device complexity and space consumption increase
Solution Approach 1:
The patent merges the LED unit and image sensor die onto a single substrate, eliminating the need for separate mounting structures and flex PCB connectors. The LED device is positioned in a first cavity while the image sensor is positioned in a second cavity on the same substrate, achieving both electrical connectivity and structural simplification.
Solution Approach 2:
The substrate serves multiple functions: it provides mechanical support for both the LED device and image sensor, establishes electrical connectivity between components, and eliminates the need for separate mounting structures. This multi-functional approach reduces overall device complexity while maintaining reliability.
2Ease of manufacture
If primitive LED packaging technology is used, then manufacturing simplicity is maintained, but space efficiency deteriorates
Solution Approach 1:
The patent positions the LED device and image sensor die within cavities formed in the substrate, creating a nested arrangement where components are housed within recesses rather than occupying surface area. This nesting approach significantly reduces the overall real estate area while maintaining ease of manufacture through standard semiconductor fabrication processes.
Solution Approach 2:
The invention transitions from planar packaging to three-dimensional cavity-based packaging. By forming cavities into the substrate and positioning components within these cavities, the design utilizes the vertical dimension to reduce footprint area while maintaining compatibility with standard manufacturing processes.
3Ease of operation
If LED unit is positioned远离 image sensor, then separate mounting is simplified, but alignment precision and compactness deteriorate
Solution Approach 1:
By merging both devices onto a single substrate with precisely defined cavities, the patent eliminates alignment issues between separate components. The cavities are formed through photolithography and etching processes that ensure precise positioning, making the mounting process straightforward while achieving superior alignment precision.
Data Source
AI summary
A camera module and method of making same, includes a substrate of conductive silicon having top and bottom surfaces, a sensor device, and an LED device. The substrate includes a first cavity formed into the bottom surface of the substrate and has an upper surface, an aperture extending from the first cavity upper surface to the top surface of the substrate, and a second cavity formed into the top surface of the substrate and having a lower surface. The sensor device includes at least one photodetector, is disposed at least partially in the first cavity, and is mounted to the first cavity upper surface. The LED device includes at least one light emitting diode, is disposed at least partially in the second cavity, and is mounted to the second cavity lower surface.