Conductive Silicone Composition for Low-Temperature Fast Curing
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Solution Overview
Problem
Conductive silicone compositions used in electronic components like liquid crystal image displays and solar cells face challenges in achieving high reliability and conductivity at low temperatures, as existing methods require high temperatures, which can degrade these components.
Innovation Solution
A conductive silicone composition comprising a polyorganosiloxane with alkenyl groups, a hydrosilyl compound, a hydrosilylation catalyst, a silane compound with an epoxy and alkoxysilyl group, and conductive powder, specifically formulated to cure at low temperatures and maintain excellent conductivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a conductive silicone composition is cured at high temperature (180°C), then high reliability is achieved, but heat-sensitive electronic components (liquid crystal displays, organic EL elements, solar cells) are degraded
Solution Approach 1:
The patent changes the curing temperature parameter from conventional high temperature (180°C) to low temperature (room temperature or slightly elevated). This is achieved by selecting specific silane-modified polysiloxane structures and catalyst systems that enable low-temperature crosslinking while maintaining curing reliability, thus preventing heat damage to sensitive electronic components
Solution Approach 2:
The patent uses composite material design by combining silane-modified polysiloxane with specific conductive fillers and catalysts. The silane groups provide low-temperature curing capability through moisture-cured or condensation-cured mechanisms, while the polysiloxane matrix ensures reliability, creating a composite system that achieves both low-temperature processing and high reliability
2Object-affected harmful factors
If a conductive silicone composition is cured at low temperature, then heat-sensitive components are protected, but curing time increases and reliability decreases
Solution Approach 1:
The patent optimizes multiple parameters simultaneously: selects silane-modified polysiloxane with appropriate molecular weight and crosslinking density, adjusts catalyst concentration and type, and controls filler content to achieve fast curing at low temperature. The silane groups react rapidly with moisture or other agents at room temperature, significantly reducing curing time compared to conventional systems
Solution Approach 2:
The patent introduces catalysts as intermediaries to accelerate the low-temperature curing reaction. The catalyst facilitates the crosslinking reaction between silane groups and polysiloxane chains at low temperature, enabling rapid curing without requiring high thermal energy, thus reducing both temperature and time requirements
3Temperature
If conventional conductive silicone composition is used, then high temperature curing is achieved, but conductivity is insufficient at low temperature applications
Solution Approach 1:
The patent designs a composite material system combining silane-modified polysiloxane matrix with optimized conductive filler (such as metal particles or carbon materials). The silane crosslinked network provides good interfacial adhesion with fillers, ensuring percolation pathways for electrical conduction, while the polysiloxane matrix maintains flexibility and conductivity at low temperature applications
Solution Approach 2:
The patent applies local quality enhancement by ensuring uniform distribution of conductive fillers within the silane-modified polysiloxane matrix. The silane groups create localized crosslinked regions that enhance filler-matrix interfacial contact, improving local conductivity pathways while maintaining overall material flexibility and low-temperature performance
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition effectively cures at low temperatures in a short time, producing a product with superior conductivity and stability, suitable for applications in sensitive electronic components without causing damage.
Implementation Method 1
a polyorganosiloxane having one or more alkenyl groups in a molecule (A), a compound having a hydrosilyl group (B), and a hydrosilylation catalyst (C)
Implementation Method 2
a silane compound having an epoxy group and an alkoxysilyl group (D)
Data Source
AI summary
An object of the present invention is to provide a conductive silicone composition that is cured at a low temperature in a short time and from which a cured product having excellent conductivity can be obtained.A conductive silicone composition containing (A) to (E) components described below and containing greater than or equal to 10 parts by mass and less than 100 parts by mass of the (D) component with respect to 100 parts by mass of the (A) component:(A) component: a polyorganosiloxane having one or more alkenyl groups in a molecule(B) component: a compound having a hydrosilyl group(C) component: a hydrosilylation catalyst(D) component: a silane compound having an epoxy group and an alkoxysilyl group(E) component: a conductive powder.