Conductive Material for Solder Placement and Void Suppression
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Solution Overview
Problem
Conventional solder particles and conductive materials with a solder layer on the surface face challenges such as slow movement towards electrodes, low conduction reliability, insulation reliability issues due to migration, and the generation of voids, especially when electrodes are narrow and when the materials are left for extended periods.
Innovation Solution
A conductive material comprising solder particles, a thermosetting compound, an acid anhydride thermosetting agent, and an organophosphorus compound, where the organophosphorus compound is in a liquid state at 25°C and the acid anhydride thermosetting agent is a solid, enhancing solder placement efficiency and reducing void formation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If conventional solder particles with a solder layer on the surface are used, then the material can be applied to electrodes, but the solder moves slowly towards the electrode and placement efficiency is low
Solution Approach 1:
The patent changes the physical and chemical parameters of the conductive material by using low-melting-point solder particles (melting point 100-200°C) combined with a specific binder resin and curing agent system. This parameter change enables the solder to melt and flow rapidly towards electrodes at relatively low temperatures, dramatically improving placement speed and efficiency compared to conventional solder particles.
Solution Approach 2:
The patent creates a composite material system consisting of solder particles, binder resin, and curing agent. This composite structure allows the solder particles to be held in a stable state during storage and application, then rapidly mobilize when heated to the melting point, solving both the storage stability and placement speed requirements.
2Duration of action of stationary object
If the conductive material is left for extended periods, then storage is possible, but solder placement efficiency decreases and voids are generated
Solution Approach 1:
The patent applies preliminary action by pre-forming stable solder particles with controlled melting points and pre-mixing them with binder resin and curing agent in optimal proportions. This preliminary preparation ensures that during storage, the material remains stable, and upon heating, the solder particles rapidly melt and place without void formation, maintaining high placement efficiency regardless of storage duration.
Solution Approach 2:
The binder resin and curing agent system provides beforehand cushioning by maintaining solder particle stability during storage and preventing premature aggregation or void formation. When heated, this system rapidly transitions to release and fix the solder in place, compensating for any storage time effects.
3Length of moving object
If narrow electrode gaps are used, then miniaturization is achieved, but migration occurs and insulation reliability decreases
Solution Approach 1:
The patent applies local quality by concentrating solder particles in the gaps between electrodes where conduction is needed, while the binder resin dominates in inter-electrode regions for insulation. This spatial differentiation of material composition maintains insulation reliability even in narrow electrode gaps, preventing migration while enabling miniaturization.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The proposed material effectively places solder on electrodes, even when left for a long time, improves conduction reliability, suppresses migration, and reduces void generation, especially in narrow electrode gaps, thereby enhancing the connection reliability between electrodes.
Implementation Method 1
an acid anhydride thermosetting agent, and an organophosphorus compound
Implementation Method 2
an organophosphorus compound, where the organophosphorus compound is in a liquid state at 25°C and the acid anhydride thermosetting agent is a solid, enhancing solder placement efficiency
Implementation Method 3
a process of heating the conductive material to a temperature not less than a melting point of the solder of the conductive particles to form a connection portion
Data Source
AI summary
There is provided a conductive material in which, even when a conductive material is left for a certain period of time, solder of conductive particles can be efficiently placed on an electrode, and, in addition, even if an electrode width and an inter-electrode width are narrow, occurrence of migration can be effectively suppressed, and generation of voids can be effectively suppressed. The conductive material according to the present invention contains a plurality of conductive particles in which an outer surface portion of a conductive portion comprises solder, a thermosetting compound, an acid anhydride thermosetting agent, and an organophosphorus compound.