Conductive Spacer Assembly for Compact Optical Component Coupling

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Solution Overview

Problem

Existing manufacturing techniques for micro-optical devices result in large device sizes and complex processes for electrical connectivity, leading to increased costs and reduced manufacturing efficiency, while also obstructing optical elements.

Innovation Solution

A method of manufacturing a spacer that adhesively couples spacer elements with a conductive coating between substrates, forming an electrically-conductive path for reliable connectivity between components, allowing for compact optical devices with reduced material costs.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If existing manufacturing techniques are used to implement electrical connectivity between components, then electrical connectivity is achieved, but the device size becomes large and manufacturing complexity increases

Engineering Contradiction:
Improveelectrical connectivityVSAvoidmanufacturing process complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The spacer element combines multiple functions into a single component: it provides mechanical spacing between optical components, establishes electrical connectivity through conductive coatings, and enables precise alignment. This merging eliminates the need for separate connection structures and complex assembly processes, directly reducing device complexity while maintaining reliable electrical connectivity.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The spacer element serves as a multi-functional component that simultaneously performs mechanical positioning, electrical connection, and alignment functions. By making the spacer universal rather than specialized for a single function, the design simplifies the overall device architecture and manufacturing process while ensuring reliable electrical connectivity between components.

Inventive Principle:
Principle #6Universality (Multi-functionality)

2Reliability

If existing manufacturing techniques are used to implement electrical connectivity between components, then electrical connectivity is achieved, but the device size becomes large

Engineering Contradiction:
Improveelectrical connectivityVSAvoiddevice size
Core Design Contradiction:
ReliabilityVSVolume of moving object

Solution Approach 1:

By merging the electrical connection function into the spacer element itself through conductive coatings, the design eliminates the need for additional connection structures that would increase device volume. The spacer becomes a compact, multi-functional component that provides both mechanical spacing and electrical connectivity without requiring extra space for separate connection mechanisms.

Inventive Principle:
Principle #5Merging (Combining)

3Reliability

If complex processes such as Laser Direct Structuring are used to place electrical connections, then electrical connectivity is achieved away from optical elements, but manufacturing cost and complexity increase

Engineering Contradiction:
Improveelectrical connectivityVSAvoidmanufacturing cost
Core Design Contradiction:
ReliabilityVSEase of manufacture

Solution Approach 1:

The spacer element is segmented into distinct functional zones: optical spacing regions and conductive connection regions. The conductive coatings are applied to specific segments of the spacer that require electrical connectivity, allowing standard manufacturing processes to be used rather than complex laser direct structuring. This segmentation enables cost-effective manufacturing while achieving reliable electrical connectivity.

Inventive Principle:
Principle #1Segmentation

4Productivity

If wafer-level manufacturing is used to produce compact optical devices, then manufacturing efficiency increases, but achieving reliable electrical connectivity becomes more challenging

Engineering Contradiction:
Improvemanufacturing efficiencyVSAvoidelectrical connectivity
Core Design Contradiction:
ProductivityVSReliability

Solution Approach 1:

By integrating the electrical connection function into the spacer element through conductive coatings, the design enables wafer-level manufacturing of compact optical devices. The spacer elements can be manufactured and prepared with conductive coatings in advance, then assembled with optical components in a standardized wafer-level process, achieving both high productivity and reliable electrical connectivity.

Inventive Principle:
Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Enables compact optical devices with reliable electrical connections, reducing material costs and increasing the number of devices per wafer through efficient wafer-level manufacturing.

Implementation Method 1

at least one of the plurality of spacer elements comprises a conductive coating and/or is adhesively coupled to the first and second substrates with an electrically-conductive adhesive, such that an electrically-conductive path is formed for electrically coupling the first and second components of the optical device

Methodology Applied
Scientific EffectElectrical conduction: Conduction (electrical)

Implementation Method 2

adhesively coupling a first substrate to each of a plurality of spacer elements; and adhesively coupling a second substrate to each of the plurality of spacer elements

Methodology Applied
Scientific EffectAdhesion: Adhesive

Data Source

PatentUS12529864B2Spacer for an optical device
Publication Date: 2026.01.20 AMS OSRAM ASIA PACIFIC PTE LTD
  • US12529864B2 patent drawing
  • US12529864B2 patent drawing
  • US12529864B2 patent drawing

AI summary

A method of manufacturing a spacer (285) for spacing apart and electrically coupling first and second components of an optical device is disclosed. The method comprises a step of adhesively coupling a first substrate (250) to each of a plurality of spacer elements (205). The method comprises a step of adhesively coupling a second substrate (275) to each of the plurality of spacer elements, such that the plurality of spacer elements are disposed between opposing surfaces of the first and second substrates. At least one of the plurality of spacer elements comprises a conductive coating and/or is adhesively coupled to the first and second substrates with an electrically-conductive adhesive, such that an electrically-conductive path (290a-d) is formed for electrically coupling the first and second components of the optical device. Also disclosed is an optical device (500) comprising a spacer (285) manufactured according to the method.