Conductive Spring Sensing Unit for Multi-Directional Signal Transmission
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Solution Overview
Problem
Conventional silicon acceleration sensors have complex structures due to the need for wiring between sensor portions, leading to increased components and manufacturing costs, and limited directional sensitivity.
Innovation Solution
A sensing unit with a conductive spring portion and movable portion supported by a substrate, where the sensor portion on the movable portion transmits signals through the spring portion, eliminating the need for separate wiring and allowing for oscillation in multiple directions, and can be formed using plating for reduced thickness and size.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If separate wiring is provided for each sensor portion, then signal transmission is achieved, but device complexity and manufacturing cost increase
Solution Approach 1:
The spring portion is designed to serve dual functions: providing mechanical support/suspension for the movable portion and simultaneously serving as the wiring path for signal transmission. This merging of structural and electrical functions eliminates the need for separate wiring, reducing device complexity while maintaining reliable signal transmission from sensor portions to the fixed portion.
2Reliability
If conventional wiring is used for each sensor portion, then signal transmission is ensured, but manufacturing cost increases
Solution Approach 1:
The spring portion integrates both mechanical support and electrical signal transmission functions into a single component. This eliminates the need for separate wiring materials and assembly steps, reducing manufacturing cost while ensuring reliable signal transmission from the movable portion to the fixed portion.
Solution Approach 2:
The spring portion is designed as a multi-functional component that simultaneously provides mechanical suspension support and electrical signal transmission pathways. This universal design allows a single component to fulfill multiple roles, simplifying the overall device structure and reducing manufacturing complexity and cost.
3Strength
If the spring portion is formed by deep etching, then structural integrity is achieved, but movable portion thickness increases
Solution Approach 1:
The manufacturing method transitions from deep etching to plating, fundamentally changing the formation parameter of the spring portion. Plating allows for precise control of layer thickness and enables the creation of thinner, more flexible movable portions while maintaining sufficient structural integrity through controlled material deposition and appropriate material selection.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design simplifies the structure, reduces manufacturing costs, and enhances directional sensitivity by allowing oscillation in multiple directions, while maintaining high measurement precision through the use of GMR sensors.
Implementation Method 1
the spring portion having the support portion and the movable portion is conductive, and a signal of the sensor portion provided on the movable portion of the spring portion is transmitted via the spring portion
Implementation Method 2
the spring portion may be formed by plating
Data Source
AI summary
In a sensing unit according to the present invention, a spring portion having a support portion and a movable portion is conductive. A signal of a sensor portion provided on the movable portion of the spring portion is transmitted via the spring portion. Hence, the sensing unit according to the present invention has a simple constitution with a small number of components, and a wire does not necessarily have to be provided for each sensor portion. As a result, a reduction in manufacturing cost, simplification of the manufacturing process, and so on are achieved.