Conductive Stair Structure for Multi-Wire IC Package Bonding

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Solution Overview

Problem

Existing integrated circuit package structures face challenges in connecting multiple bonding wires to a single bonding pad, leading to increased area occupation.

Innovation Solution

The introduction of a conductive stair structure with stepped sidewalls and planes on the circuit board, allowing for multiple bonding wires to connect to different heights, utilizing a seed layer and buffer connectors to enhance connectivity.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If multiple bonding wires are connected to one bonding pad simultaneously, then the connectivity is improved, but the area occupation increases

Engineering Contradiction:

ImproveconnectivityVSAvoidarea occupation

Core Design Contradiction:

Adaptability or versatilityVSArea of stationary object

Solution Approach 1:

The patent transitions from a two-dimensional bonding pad to a three-dimensional conductive stair structure with multiple steps at different heights. This vertical dimensionality change allows multiple bonding wires to connect to different steps simultaneously, improving connectivity while maintaining a compact footprint on the circuit board.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The conductive stair structure is segmented into multiple steps, each at a different height level. This segmentation allows individual bonding wires to connect to specific steps, enabling multiple connections from a single bonding pad location without increasing the horizontal area occupation.

Inventive Principle:

Principle #1Segmentation

2Area of stationary object

If the area of bonding pads is reduced, then the space efficiency is improved, but the connectable area for bonding wires is reduced

Engineering Contradiction:

Improvespace efficiencyVSAvoidconnectable area

Core Design Contradiction:

Area of stationary objectVSArea of moving object

Solution Approach 1:

By extending the conductive structure vertically into multiple steps at different heights, the patent increases the connectable surface area without increasing the horizontal footprint. Bonding wires can attach to multiple steps simultaneously, providing adequate connection area while maintaining high space efficiency on the circuit board.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The conductive stair structure employs a composite configuration combining conductive material with seed layers and buffer connectors. This composite structure provides both mechanical support and electrical conductivity across multiple height levels, ensuring sufficient connectable area in a compact form factor.

Inventive Principle:

Principle #40Composite materials

Data Source

PatentUS12374609B2Integrated circuit package structure with conductive stair structure

Publication Date: 2025.07.29 NAN YA TECH

AI summary

An integrated circuit package structure includes a circuit board, an integrated circuit die and a conductive stair structure. The circuit has an upper surface. The integrated circuit die is located on the upper surface of the circuit board. The conductive stair structure is located on the upper surface of the circuit board. The conductive stair structure includes steps along a first direction substantially perpendicular to the upper surface of the circuit board. The steps have different heights relative to the upper surface of the circuit board.