Conductive Stiffener Shielding for Multi-Chip Package Interference
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Solution Overview
Problem
In multi-chip packages, devices often interfere with each other due to electromagnetic interference (EMI) and radio-frequency interference (RFI), making it difficult to allocate volume and position components closely without causing electrical interference.
Innovation Solution
An electrically conductive stiffener is used to partially shield devices from each other, allowing for closer positioning of components by reducing electrical interference and potentially decreasing package size and signal travel time, formed with recesses for dies and a central hole for chips, connected via electrical connections through the stiffener.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If devices are positioned closer together in a multi-chip package, then package size is reduced, but electromagnetic interference and radio-frequency interference between devices increases
Solution Approach 1:
A conductive stiffener is introduced as an intermediary element between adjacent dies in the multi-chip package. The stiffener includes conductive portions that extend between and around the dies, acting as a shielding barrier that blocks electromagnetic and radio-frequency interference while allowing the dies to be positioned in close proximity. This mediator structure enables reduced package size without suffering from increased EMI.
Solution Approach 2:
The conductive stiffener is configured with thin conductive portions that extend between and around the dies, forming a shielding structure similar to a Faraday cage. These conductive portions can be implemented as thin films or layered structures that provide effective electromagnetic shielding while occupying minimal space, thus enabling close component placement without increasing package volume.
2Loss of time
If devices are positioned closer together, then signal travel time is reduced, but electrical interference between devices increases
Solution Approach 1:
The conductive stiffener serves as a shielding intermediary that allows signals to travel shorter distances between closely positioned dies while blocking electrical interference. The conductive portions extend between the dies, providing both the physical support for close positioning and the electromagnetic shielding necessary to prevent interference, thus reducing signal travel time without increasing electrical interference.
3Object-affected harmful factors
If conductive portions extend between and around dies, then shielding effectiveness is improved, but manufacturing complexity increases
Solution Approach 1:
The stiffener is designed to perform multiple functions simultaneously: it provides mechanical support to maintain die positioning, electrical shielding to block interference, and structural rigidity to support the multi-chip package. By combining these functions into a single component, the design achieves effective shielding without proportionally increasing manufacturing complexity, as the same structure that provides shielding also provides mechanical support.
Solution Approach 2:
The stiffener may be constructed using composite materials or multi-layer structures that combine conductive and non-conductive properties in different regions. This allows the conductive portions to provide shielding where needed while non-conductive portions facilitate manufacturing processes such as bonding and alignment, thereby reducing overall manufacturing complexity while maintaining shielding effectiveness.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The electrically conductive stiffener effectively reduces device-to-device interference, enabling closer component placement, minimizing package size and signal delay, while maintaining electrical connectivity and shielding.
Implementation Method 1
an electrically conductive stiffener that at least partially electrically shields the devices from one another
Implementation Method 2
the stiffener can at least partially electrically shield the dies from one or more chips, connected to the substrate
Data Source
AI summary
To overcome the problem of devices in a multi-chip package (MCP) interfering with one another, such as through electromagnetic interference (EMI) and/or radio-frequency interference (RFI), the chip package can include an electrically conductive stiffener that at least partially electrically shields the devices from one another. At least some of the devices can be positioned in respective recesses in the stiffener. In some examples, when the devices are positioned in the recesses, at least one device does not extend beyond a plane defined by a first side of the stiffener. Such shielding can help reduce interference between the devices. Because device-to-device electrical interference can be reduced, devices on the package can be positioned closer to one another, thereby reducing a size of the package. The devices can electrically connect to a substrate via electrical connections that extend through the stiffener.