Conductive Strip Mask for Semiconductor Metallization
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Solution Overview
Problem
Current semiconductor device manufacturing processes are inefficient, particularly in the production of photovoltaic cells, where increasing efficiency while maintaining cost-effectiveness remains a challenge.
Innovation Solution
A novel method for manufacturing semiconductor devices involves forming metal regions over semiconductor substrates, using conductive strips to create conductive contacts through a bonding and etching process, which enhances the electrical connections and reduces reflection by texturing the surface, thereby improving light collection and energy conversion efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If conventional manufacturing processes are used for semiconductor devices, then the production process is simpler, but the manufacturing efficiency is low
Solution Approach 1:
The manufacturing process is segmented into distinct stages: forming metal regions, depositing conductive material, applying mask, etching, and removing mask. This segmentation allows each step to be optimized independently, improving overall manufacturing efficiency while maintaining process clarity and control.
Solution Approach 2:
Metal regions are formed on the semiconductor substrate before the actual conductive contact fabrication. This preliminary action prepares the substrate in advance, enabling subsequent steps to proceed more efficiently and reducing overall manufacturing time.
2Reliability
If metal regions are formed over semiconductor substrates with conductive contacts, then electrical conduction is enhanced, but the manufacturing process becomes more complex
Solution Approach 1:
A conductive material layer is deposited as an intermediary between the metal regions and the semiconductor substrate. This intermediary layer facilitates reliable electrical conduction while providing a controlled interface that simplifies the overall manufacturing process compared to direct metal-to-substrate contact.
Solution Approach 2:
Conductive material is selectively deposited only in specific regions where conductive contacts are needed, rather than uniformly across the entire substrate. This local quality approach enhances electrical conduction where required while reducing material usage and process complexity.
3Reliability
If conductive strips are used to form conductive contacts through bonding and etching, then electrical connections are improved, but the manufacturing time increases
Solution Approach 1:
The bonding and etching operations are merged into an integrated process sequence where conductive strips are bonded to metal regions and then etched together as a unit. This combination reduces the number of separate manufacturing steps, improving electrical connections while minimizing additional manufacturing time.
4Use of energy by moving object
If surface texturing is applied to reduce reflection, then light absorption is enhanced, but the manufacturing process becomes more complex
Solution Approach 1:
The surface of the semiconductor substrate is textured with curved or rounded features rather than flat surfaces. This curvature reduces reflection by scattering incident light at multiple angles, enhancing light absorption while achieving the effect through a relatively simple surface modification process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method increases the efficiency and cost-effectiveness of semiconductor device production by enhancing light absorption and electrical current conduction, leading to improved performance in semiconductor devices such as solar cells.
Implementation Method 1
a bonding process is performed to bond a contacting portion of the conductive strip to the first portion of the metal region
Implementation Method 2
an etching process is performed to form conductive contacts using the conductive strip as a mask
Implementation Method 3
texturing the surface, thereby improving light collection
Data Source
AI summary
Methods of manufacturing a semiconductor device, and resulting semiconductor device are described. In an example, the method for manufacturing a semiconductor device include forming a semiconductor region and forming a metal seed region over the semiconductor region. The method can include placing a conductive strip over a first portion of the metal region, where the conductive strip is formed over the semiconductor region. The method can include bonding a contacting portion of the conductive strip to the first portion the metal region. The method can include etching a second portion of the metal region and where the conductive strip inhibits etching of the first portion of the metal region. In an example, the conductive strip can have a coating. In one example, the semiconductor device can be a solar cell.