Conductive Structure Using Cured Layer to Eliminate Solder

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Solution Overview

Problem

Existing conductive structures for heat generators require the use of conductive joining materials like solder to achieve low contact resistance, which complicates the electrical connection between conductive linear bodies and electrodes, reducing production efficiency.

Innovation Solution

A conductive structure with a cured layer formed by a curable composition containing a cationic polymerizable compound and a photocationic polymerization initiator is used to directly contact and fix the electrodes with the conductive linear bodies, eliminating the need for conductive joining materials.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If conductive joining material such as solder is used to join electrodes to conductive linear bodies, then contact resistance is reduced, but manufacturing complexity increases and production efficiency decreases

Engineering Contradiction:

Improvecontact resistanceVSAvoidmanufacturing process complexity

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The invention extracts and eliminates the conductive joining material (solder) from the connection process. Instead of using solder to join electrodes to conductive linear bodies, the patent uses a support body with a cavity that directly receives and holds the conductive linear body, with electrodes making direct contact. This removes the intermediate joining material and simplifies the manufacturing process while maintaining low contact resistance through direct metal-to-metal contact.

Inventive Principle:

Principle #2Taking out (Extraction)

Solution Approach 2:

The support body acts as an intermediary structure that facilitates direct contact between electrodes and conductive linear bodies. The cavity in the support body holds the conductive linear body in position, allowing electrodes to make direct electrical contact without requiring solder or other joining materials. The support body mediates the mechanical and electrical connection in a single integrated structure.

Inventive Principle:

Principle #24Intermediary (Mediator)

2Reliability

If conductive joining material is used to connect electrodes and conductive linear bodies, then electrical connection is achieved, but production time increases

Engineering Contradiction:

Improveelectrical connectionVSAvoidproduction efficiency

Core Design Contradiction:

ReliabilityVSProductivity

Solution Approach 1:

The support body is pre-formed with a cavity designed to receive the conductive linear body. The electrodes are positioned to make direct contact with the conductive linear body as it is placed in the cavity. This preliminary preparation of the support structure eliminates the need for subsequent soldering steps, reducing production time while ensuring reliable electrical connection through direct contact.

Inventive Principle:

Principle #10Preliminary action

3Reliability

If solder or conductive joining material is used, then low contact resistance is achieved, but the number of manufacturing steps increases

Engineering Contradiction:

Improvecontact resistanceVSAvoidmanufacturing simplicity

Core Design Contradiction:

ReliabilityVSEase of manufacture

Solution Approach 1:

The invention merges the mechanical support function and the electrical connection function into a single integrated structure. The support body with its cavity provides both mechanical holding of the conductive linear body and facilitates electrical contact through the electrodes. This consolidation eliminates the separate soldering step, reducing manufacturing complexity while maintaining low contact resistance through direct electrode-to-conductive body contact.

Inventive Principle:

Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This method enables a conductive structure with low contact resistance without using solder or similar materials, enhancing production efficiency by directly connecting the electrodes to the conductive linear bodies through a reliable fixing mechanism.

Implementation Method 1

a cured layer formed by curing a curable composition; the curable composition contains a cationic polymerizable compound and a photocationic polymerization initiator

Methodology Applied

Scientific EffectPhotocationic polymerization: Photopolymerisation

Data Source

PatentUS20230337331A1Conductive structure, manufacturing method for conductive structure, article including conductive structure, and manufacturing method for article including conductive structure

Publication Date: 2023.10.19 LINTEC CORP

AI summary

Provided are a conductive structure having low contact resistance, the conductive structure including a cured layer formed by curing a curable composition, a conductive linear body fixed by the cured layer, and a pair of electrodes placed so as to directly contact the conductive linear body, wherein the curable composition contains a cationic polymerizable compound and a photocationic polymerization initiator, and the cured layer fixes the electrodes; a manufacturing method for the conductive structure; and article including the conductive structure; and a manufacturing method for the article.