Conductive Structure Grounding Metal Frame HDMI Connector

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Solution Overview

Problem

Conventional HDMI connectors experience significant noise interference due to electro-magnetic waves during high-speed data transmissions, leading to decreased signal transmission speed, which is not adequately addressed by metal housings.

Innovation Solution

An electronic device design that includes a substrate with a ground layer, a metal frame connector, and a conductive structure that couples the metal frame to a ground bracket, reducing noise interference by decreasing resistance and facilitating the conduction of surface currents to the ground bracket.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Strength

If a conventional HDMI connector is encased in a metal housing, then the connector is physically protected, but the noise interference problem still cannot be properly solved

Engineering Contradiction:
Improvephysical protectionVSAvoidnoise interference
Core Design Contradiction:
StrengthVSObject-affected harmful factors

Solution Approach 1:

The patent introduces a conductive structure as an intermediary element between the metal frame and ground bracket. This conductive structure (comprising conductive adhesive and conductive mesh) serves as a mediator to establish effective electrical connection for grounding, which the metal housing alone cannot achieve. The intermediary enables proper noise interference resolution while maintaining the physical protection benefit.

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The patent employs composite materials by combining conductive adhesive with conductive mesh to form the conductive structure. This composite approach enhances the electrical connection effectiveness between the metal frame and ground bracket, creating a more reliable grounding path that reduces noise interference better than simple metal housing encasement.

Inventive Principle:
Principle #40Composite materials

2Speed

If high-speed data transmission is performed, then data transmission speed is increased, but electro-magnetic waves are generated causing noise interference

Engineering Contradiction:
Improvedata transmission speedVSAvoidelectro-magnetic wave noise
Core Design Contradiction:
SpeedVSObject-generated harmful factors

Solution Approach 1:

The patent converts the harmful electro-magnetic noise generated by high-speed data transmission into a manageable issue by providing an effective grounding path. The conductive structure directs the noise currents away from signal paths and into the ground bracket, transforming the harmful electromagnetic interference into controlled current flow that can be safely dissipated.

Inventive Principle:
Principle #22Blessing in disguise (Convert harm into benefit)

3Device complexity

If the resistance between metal frame and ground bracket is high, then the connection is simpler, but surface current cannot be conducted to ground bracket fast enough

Engineering Contradiction:
Improveconnection simplicityVSAvoidnoise reduction effectiveness
Core Design Contradiction:
Device complexityVSReliability

Solution Approach 1:

The patent uses composite materials (conductive adhesive combined with conductive mesh) to create the conductive structure. This composite approach achieves low resistance electrical connection without excessive complexity, as the conductive adhesive provides base connectivity while the conductive mesh enhances current distribution and reduces overall resistance, enabling effective noise current conduction to the ground bracket.

Inventive Principle:
Principle #40Composite materials

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution effectively reduces signal attenuation by 20% from 40%, improving signal transmission speed by minimizing noise interference through the conductive structure's electrical connection between the metal frame and ground bracket.

Implementation Method 1

the conductive structure electrically connects the ground bracket to the metal frame

Methodology Applied
Scientific EffectElectrical conduction: Conduction (electrical)

Data Source

PatentUS10615525B1Electronic device with conductive structure directly abutting metal frame to ground bracket
Publication Date: 2020.04.07 WISTRON NEWEB CORP
  • US10615525B1 patent drawing
  • US10615525B1 patent drawing
  • US10615525B1 patent drawing

AI summary

An electronic device is provided. The electronic device includes a substrate, a connector, a ground bracket and a conductive structure. The substrate includes a ground layer. The connector is disposed on the substrate, wherein the connector includes a metal frame. The ground bracket is affixed on the substrate and coupled to the ground layer, wherein at least a portion of the connector is located in the ground bracket. The conductive structure is adapted to abut the metal frame and to abut the ground bracket, wherein when the conductive structure connects the metal frame to the ground bracket, the conductive structure electrically connects the ground bracket to the metal frame.