Conductive Structure Removal Without Substrate Corrosion
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Challenges exist in creating microscale electrical connections on surfaces of PCBs, silicon-based electronic components, and flexible substrates due to difficulties in removing conductive structures affixed to these substrates during additive manufacturing processes.
Innovation Solution
A method involving additively manufacturing a conductive structure on a substrate, sintering it, and then removing it using a wet method that includes contacting the structure with a solution at specific temperatures and applying ultrasonic vibrations for controlled periods.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If conventional methods are used to remove conductive structures, then removal capability is achieved, but substrate integrity is compromised through etching or corrosion
Solution Approach 1:
The patent introduces a solution as an intermediary medium between the conductive structure and the substrate. This solution selectively interacts with the conductive structure to enable its removal while protecting the substrate from direct exposure to harmful removal mechanisms, thus preventing etching or corrosion.
Solution Approach 2:
The patent employs controlled temperature parameters (10°C to 120°C) and time parameters (1 minute to 24 hours) in the solution-based removal process. By adjusting these parameters, the removal effectiveness is optimized while substrate damage is prevented, resolving the contradiction between removal capability and substrate integrity preservation.
2Reliability
If conductive structures are permanently affixed to substrates, then connection reliability is improved, but process flexibility is reduced
Solution Approach 1:
The patent transforms the static nature of conductive structure-substrate bonds into a dynamic state. The conductive structures can be securely attached during manufacturing and then selectively removed when needed, allowing the system to adapt between permanent connection and temporary removal based on process requirements.
Solution Approach 2:
The patent enables the selective discarding of conductive structures after they have served their temporary function during additive manufacturing processes. This allows for process flexibility where conductive structures can be removed and substrates recovered for subsequent processing steps or reuse.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Effectively removes conductive structures from substrates without etching or corroding them, enabling more temporary additive manufacturing processes and preserving substrate integrity.
Implementation Method 1
The solution is at a temperature in a range of 10° C. to 120° C.
Implementation Method 2
applying ultrasonic vibrations for controlled periods
Data Source
AI summary
Methods for removing a conductive structure from a substrate are provided. The method includes additively manufacturing a conductive structure on a substrate. The method includes sintering the conductive structure and performing a manufacturing process with the conductive structure. The method includes removing the conductive structure from the substrate.