Conductive Structures on Non-Conductive Substrates
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Solution Overview
Problem
Current methods for producing electrically conductive structures on non-conductive substrates face challenges such as inadequate adhesion, high material and energy costs, and limited flexibility, particularly in achieving thin, conductive layers with good abrasion resistance and precise, localized coating.
Innovation Solution
A method involving the electrochemical deposition of metals onto substrates using solubilisates or dispersions of conductive materials like carbon allotropes, conductive polymers, and inorganic oxides, applied in a locally limited manner through printing processes, followed by drying or curing, to achieve thin, conductive, and abrasion-resistant layers.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional printing processes with silver pastes are used, then conductor tracks can be produced, but sufficient conductivity cannot be achieved without sintering which destroys plastic substrates
Solution Approach 1:
The patent uses silver nanoparticles instead of conventional silver pastes, fundamentally changing the particle size parameter. This enables the formation of conductive tracks at lower temperatures that do not damage plastic substrates, achieving both conductivity and substrate compatibility
Solution Approach 2:
The patent employs a disposable sacrificial layer (such as organic material or water-soluble polymer) that is removed after metal deposition. This layer enables metal adhesion to non-conductive substrates without requiring permanent modification of the substrate, avoiding damage from conventional sintering processes
2Reliability
If chemical vapor deposition (CVD) processes are used, then conductor tracks can be produced, but the process becomes very complex and cost-intensive
Solution Approach 1:
The patent replaces complex chemical vapor deposition processes with a simpler combination of printing technology followed by electrochemical metal deposition. This substitution of process mechanisms dramatically reduces equipment complexity and operational costs while maintaining conductor track quality
Solution Approach 2:
The patent divides the conductor track production into separate sequential steps: first applying a conductive precursor layer through printing, then depositing metal through electrochemical processes. This segmentation allows each step to be optimized independently, avoiding the need for complex integrated CVD systems
3Shape
If casting techniques are used, then microstructured objects can be produced, but uniform coatings cannot be achieved due to surface tension preventing proper wetting
Solution Approach 1:
The patent introduces a sacrificial or binder layer as an intermediary between the mold surface and the metal casting. This intermediate layer modifies surface tension characteristics, enabling proper wetting and uniform coating of microstructured surfaces that would otherwise be difficult to coat evenly
Solution Approach 2:
The patent changes the physical and chemical parameters of the casting compound or mold surface to improve wetting behavior. This may involve adjusting viscosity, surface energy, or temperature parameters to ensure uniform distribution of casting material in fine microstructures
4Reliability
If conventional electroplating methods are used, then conductive coatings can be produced, but adhesion to non-conductive substrates is inadequate
Solution Approach 1:
The patent applies a conductive precursor layer or sacrificial layer to the non-conductive substrate before electroplating. This preliminary action creates a surface that readily accepts metal deposition, ensuring strong adhesion without requiring complex substrate pretreatment or modification processes
Solution Approach 2:
The patent uses a binder layer or sacrificial layer as an intermediary between the non-conductive substrate and the metal coating. This intermediate layer provides a surface that is both compatible with the substrate and receptive to metal deposition, solving the adhesion problem while maintaining process simplicity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method enables the production of thin, highly conductive, and mechanically resilient electrically conductive structures with improved adhesion and abrasion resistance, allowing for efficient and flexible creation of microstructured objects and components without the need for complex processes like etching or sintering.
Implementation Method 1
at least one solubilisate and/or a dispersion based on electrically conductive materials is applied to an electrically non-conductive substrate, wherein the application of the solubilisate and/or the dispersion is carried out in a locally limited and/or location-specific manner using a printing process
Implementation Method 2
wherein optionally a subsequent process step of drying or curing the solubilisate and/or the dispersion is carried out
Implementation Method 3
wherein in a subsequent process step at least one metal is deposited electrochemically on the optionally dried or hardened solubilisate and/or on the optionally dried or hardened dispersion
Data Source
AI summary
The method relates to a method for producing electrically conductive structures on electrically non-conductive substrates and to a method for the electrochemical deposition of metals on substrates, which is suitable in particular for producing metallic structures and/or electroplated plastics. The invention further relates to products obtainable in this way and to the use thereof.