Conductive Substrate with Embedded Cooling Channels

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Solution Overview

Problem

Conventional heat sinks are inadequate in effectively lowering the operating temperature of power electronics due to increased heat flux generated by advanced electrical systems, necessitating alternative cooling solutions.

Innovation Solution

A power electronics module featuring an electrically-conductive substrate with integrated channels and pathways that allows for direct coupling with the power electronics device, enabling the passage of both electrical current and cooling fluid to enhance heat dissipation without intervening components.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If conventional heat sinks are used to cool power electronics, then the structure is simple and easy to manufacture, but the heat dissipation effectiveness is insufficient due to increased heat flux

Engineering Contradiction:

Improveoperating temperatureVSAvoidheat flux

Core Design Contradiction:

TemperatureVSLoss of energy

Solution Approach 1:

The patent merges the electrical substrate and cooling channel structure into a single integrated component. The electrically-conductive substrate contains embedded cooling channels that extend through it, allowing the substrate to simultaneously perform its electrical function and provide thermal management. This integration eliminates the need for separate heat sink components and enables direct thermal coupling between the power electronics device and the cooling fluid.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The electrically-conductive substrate is designed to serve multiple functions: it provides electrical conduction for power transmission, structural support for mounting power electronics devices, and thermal management through integrated cooling channels. This multi-functionality allows a single component to address both electrical and thermal requirements, improving heat dissipation effectiveness while simplifying the overall system architecture.

Inventive Principle:

Principle #6Universality (Multi-functionality)

2Loss of energy

If cooling channels are integrated into the electrically-conductive substrate, then heat transfer efficiency is improved by positioning cooling fluid closer to the power electronics device, but the device complexity increases

Engineering Contradiction:

Improveheat transfer efficiencyVSAvoidsubstrate structure

Core Design Contradiction:

Loss of energyVSDevice complexity

Solution Approach 1:

The cooling channels are integrated directly into the electrically-conductive substrate, merging two previously separate functions (electrical conduction and thermal management) into a single component. This integration positions the cooling fluid in direct thermal contact with the substrate, maximizing heat transfer efficiency while eliminating the need for additional heat sink components and their associated mounting hardware.

Inventive Principle:

Principle #5Merging (Combining)

3Temperature

If multiple channels extend through the electrically-conductive substrate, then cooling effectiveness is enhanced, but the manufacturing complexity increases

Engineering Contradiction:

Improvecooling effectivenessVSAvoidsubstrate fabrication

Core Design Contradiction:

TemperatureVSEase of manufacture

Solution Approach 1:

The cooling channels are formed within the electrically-conductive substrate during the substrate fabrication process itself, before the substrate is assembled into the final power electronics module. This preliminary action allows the channels to be integrated into the substrate structure using standard manufacturing techniques, avoiding the need for complex post-assembly operations and reducing overall manufacturing complexity.

Inventive Principle:

Principle #10Preliminary action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration positions the cooling fluid closer to the power electronics device, improving heat transfer efficiency and effectively managing thermal energy generated by the device.

Implementation Method 1

Cooling fluid may be used to receive heat generated by the heat-generating device by convective and/or conductive thermal transfer

Methodology Applied

Scientific EffectConvection: Convection

Implementation Method 2

Cooling fluid may be used to receive heat generated by the heat-generating device by convective and/or conductive thermal transfer

Methodology Applied

Scientific EffectConduction (thermal): Conduction (thermal)

Data Source

PatentUS10896865B2Power electronics modules including an integrated cooling channel extending through an electrically-conductive substrate

Publication Date: 2021.01.19 DENSO CORP

AI summary

A power electronics module includes a power electronics device, and an electrically-conductive substrate directly coupled to the power electronics device, the electrically-conductive substrate defining a plurality of channels extending through the electrically-conductive substrate, and a plurality of electrical pathways extending through the electrically-conductive substrate around the plurality of channels.