Conductive Substrate via Insulating Mask Over-etching
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Solution Overview
Problem
The existing methods for preparing conducting substrates in organic light emitting devices and solar cells are complex and costly due to the need for multiple patterning processes and the use of materials like polyimide, which absorbs light and is difficult to pattern effectively.
Innovation Solution
A method that simplifies the process by forming a metal layer on a conducting substrate, using an insulating layer pattern as a mask for over-etching to create a metal layer pattern, and then reforming the insulating layer to cover the metal layer without the need for separate photoresist or stripping solutions, thereby reducing equipment costs and environmental impact.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If multiple patterning processes are used to form the auxiliary electrode, then the electrode structure is achieved, but the process complexity and equipment investment cost increase
Solution Approach 1:
The patent combines multiple patterning processes into a single patterning step by using a dual-layer structure where the first insulating layer pattern and second insulating layer pattern are formed simultaneously or in sequence without requiring separate photoresist application and stripping steps for each metal layer pattern.
Solution Approach 2:
The first insulating layer pattern is formed in advance before depositing the second metal layer, serving as a pre-established mask that guides the subsequent patterning process and eliminates the need for separate photoresist steps.
2Reliability
If polyimide is used as the insulating material, then the insulating layer is formed, but light absorption increases and transparency decreases
Solution Approach 1:
The patent changes the material parameter of the insulating layer from polyimide to organic resin materials with superior optical transparency, maintaining the insulating function while significantly improving light transmission properties for OLED applications.
3Manufacturing precision
If separate photoresist material and stripping solution are used, then the metal layer pattern is formed, but cost and environmental pollution increase
Solution Approach 1:
The insulating layer patterns serve their dual function as both structural insulators and patterning masks, eliminating the need for separate photoresist materials and stripping solutions, thereby reducing chemical waste and processing costs.
4Manufacturing precision
If the mask pattern is removed after forming the metal layer pattern, then the metal pattern is created, but foreign substrates remain causing short-circuits
Solution Approach 1:
The insulating layer patterns perform multiple functions: they serve as masks during metal layer patterning, remain in place to prevent short-circuits, and provide electrical insulation between metal layers, eliminating the need for removal and subsequent re-patterning steps.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces the number of processes, minimizes equipment costs, prevents short-circuits by eliminating foreign substrates, and enhances transparency by avoiding light-absorbing materials, resulting in a more economically feasible and efficient conducting substrate.
Implementation Method 1
forming a metal layer on the entire surface of the substrate comprising the conducting layer
Implementation Method 2
reforming the insulating layer pattern... the insulating layer pattern which is not insulated by the insulating layer pattern is not present, and as a result, the foreign substrate does not remain, thereby preventing a short-circuit
Data Source
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AI summary
Provided are a conducting substrate and a method for preparing the same. The method for preparing the conducting substrate according to an embodiment of the present application includes a) providing a substrate comprising a conducting layer; b) forming a metal layer on the entire surface of the substrate comprising the conducting layer; c) forming an insulating layer pattern on the metal layer; d) forming a metal layer pattern by over-etching the metal layer by using the insulating layer pattern as a mask; and e) reforming the insulating layer pattern.