Conductive Substrate with Nickel-Copper Blackened Layer for Simultaneous Etching

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Solution Overview

Problem

Conventional conductive substrates face challenges in simultaneous etching of metal and blackened layers due to differing etchant reactivity, leading to issues like side etching and undercut, which affect electrode shape and adhesion strength, and require separate etching steps increasing process complexity.

Innovation Solution

A laminated substrate comprising a transparent base material with a blackened layer containing oxygen, copper, and nickel, where the nickel ratio is between 11 mass % and 60 mass %, allowing for simultaneous etching of the copper and blackened layers with comparable reactivity to the etching solution.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Device complexity

If simultaneous etching of metal layer and blackened layer is performed, then process complexity is reduced, but etching precision deteriorates due to different reactivity between layers

Engineering Contradiction:

Improveetching process complexityVSAvoidetching precision

Core Design Contradiction:

Device complexityVSManufacturing precision

Solution Approach 1:

The invention changes the compositional parameters of the blackened layer by controlling the nickel content ratio (11-60 mass%) to adjust etching reactivity. This parameter modification enables the blackened layer to etch at a rate comparable to the copper layer, allowing simultaneous etching while maintaining precision.

Inventive Principle:

Principle #35Parameter changes

Solution Approach 2:

The invention uses a composite blackened layer made of nickel and copper with specific compositional ratios. This composite structure provides both the desired black coloration and controlled etching reactivity, enabling simultaneous etching of both layers with comparable rates.

Inventive Principle:

Principle #40Composite materials

2Strength

If etching speed of blackened layer is significantly slow, then adhesion strength is improved, but side etching occurs affecting electrode shape

Engineering Contradiction:

Improveadhesion strengthVSAvoidelectrode shape

Core Design Contradiction:

StrengthVSShape

Solution Approach 1:

The invention optimizes the nickel content parameter in the blackened layer to fall within 11-60 mass%. This parameter control balances etching speed to prevent side etching while maintaining sufficient adhesion strength through proper undercut.

Inventive Principle:

Principle #35Parameter changes

Solution Approach 2:

The invention allows controlled excessive undercut (partial etching beyond the pattern boundary) within specific limits to ensure adequate adhesion strength while preventing excessive side etching that would compromise electrode shape integrity.

Inventive Principle:

Principle #16Partial or excessive action

3Shape

If etching speed of blackened layer is significantly high, then side etching is prevented, but undercut occurs reducing adhesive width

Engineering Contradiction:

Improveelectrode shapeVSAvoidadhesion strength

Core Design Contradiction:

ShapeVSStrength

Solution Approach 1:

The invention controls the nickel content parameter to prevent excessive undercut while maintaining sufficient adhesive width. The specific ratio range (11-60 mass% nickel) ensures the blackened layer etches fast enough to prevent side etching but not so fast as to create excessive undercut.

Inventive Principle:

Principle #35Parameter changes

4Manufacturing precision

If separate etching steps for metal layer and blackened layer are performed, then etching precision is maintained, but process complexity increases

Engineering Contradiction:

Improveetching precisionVSAvoidetching process complexity

Core Design Contradiction:

Manufacturing precisionVSDevice complexity

Solution Approach 1:

The invention merges the etching processes of the metal layer and blackened layer into a single simultaneous etching step. By matching their etching rates through compositional control, both layers can be patterned together, reducing process steps while maintaining precision.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The invention creates a universal etching process that works for both the copper metal layer and the blackened layer simultaneously. The controlled nickel-containing blackened layer serves as both a protective layer and an etchable layer with matched reactivity to the copper layer.

Inventive Principle:

Principle #6Universality (Multi-functionality)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Enables efficient simultaneous etching of the copper and blackened layers, improving electrode shape consistency and adhesion strength while reducing process complexity and light reflection, thus enhancing the visibility of displays in touch panels.

Implementation Method 1

reactivity to an etchant is greatly different between the metal layer and the blackened layer... etching speed of the blackened layer... reactivity to the etching solution

Methodology Applied

Scientific EffectChemical reaction (etching): Chemical Bonding

Data Source

PatentUS10649592B2Conductive substrate and method for fabricating conductive substrate

Publication Date: 2020.05.12 SUMITOMO METAL MINING CO LTD

AI summary

A laminated substrate is provided that includes a transparent base material, and a laminated body formed at least one surface of the transparent base material. The laminated body includes a blackened layer containing oxygen, copper, and nickel, and a copper layer. A ratio of the nickel is 11 mass % or more and 60 mass % or less, among the copper and the nickel contained in the blackened layer.