Conductive Substrate Shielding for Electron Beam Crosstalk
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Solution Overview
Problem
In multi-beam electron beam drawing apparatuses, unintended beam deflection and crosstalk occur due to the influence of electric fields generated by electrode pairs other than those intended for beam deflection, affecting the precision and throughput of semiconductor device manufacturing.
Innovation Solution
A semiconductor device configuration featuring a first substrate with through-holes and adjacent electrodes, paired with a second substrate having conductive surfaces and through-holes that are electrically connected, is used to shield electric fields and suppress crosstalk by positioning the second substrate close to the first substrate while maintaining non-contact with power supply electrodes, thereby reducing the impact of unwanted electric field interference.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If a blanking aperture array with electrode pairs is used for multi-beam electron beam drawing, then throughput is significantly improved, but unintended beam deflection and crosstalk occur due to electric fields from adjacent electrode pairs
Solution Approach 1:
A grounded substrate is introduced as an intermediary component between adjacent electrode pairs. This substrate acts as a mediator that absorbs and dissipates stray electric fields, preventing them from causing unintended deflection or crosstalk between neighboring electron beams, thus resolving the precision issue while maintaining the throughput benefit of multi-beam operation
Solution Approach 2:
The harmful electric fields are extracted and redirected to the grounded substrate. By providing a dedicated path for stray electric field lines to terminate on the grounded substrate, the harmful effects are removed from the beam paths, eliminating crosstalk while preserving the functional electrode pairs for intended beam control
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively suppresses crosstalk, enhancing the precision and throughput of electron beam patterning in semiconductor device manufacturing by minimizing the influence of unintended electric fields on beam deflection.
Implementation Method 1
at least a surface of the second substrate facing the first substrate having conductivity, the second substrate being electrically connected to the second electrodes
Data Source
AI summary
A semiconductor device according to the embodiments includes: a first substrate having a plurality of first through-holes; a plurality of first electrodes provided on the first substrate to be adjacent to the respective first through-holes; a plurality of second electrodes provided on the first substrate to be adjacent to the respective first through-holes and to face the respective first electrodes; and a second substrate provided to face the first substrate, the second substrate having a plurality of second through-holes facing the respective first through-holes, at least a surface of the second substrate facing the first substrate having conductivity, the second substrate being electrically connected to the second electrodes.