Conductive Substrate Wet Blackened Layer
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Solution Overview
Problem
Conventional conductive substrates for electrostatic-capacitance-type touch panels face challenges with low productivity due to the time-consuming process of forming a blackened layer to prevent metallic luster on metal foils, which affects the visibility and efficiency of larger display panels.
Innovation Solution
A conductive substrate with a transparent base material, a metal layer, and a blackened layer formed by a wet method, along with an adhesion layer of Ni-Cu alloy including oxygen, which enhances adhesion and prevents reflection, is developed. The adhesion layer is formed by dry plating between the transparent base material and the metal layer, improving productivity and reducing reflectance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If a blackened layer is formed by a dry method to prevent metallic luster on metal foil, then light reflection is prevented, but the process time increases and productivity decreases
Solution Approach 1:
The patent replaces the dry method (physical vapor deposition) with a wet method (chemical solution processing) for forming the blackened layer. This substitution allows the blackened layer to be formed more quickly while still achieving sufficient thickness to prevent metallic luster, thereby resolving the contradiction between preventing light reflection and maintaining high productivity
Solution Approach 2:
The patent changes the formation method parameter from dry to wet processing, and optimizes the thickness parameter of the blackened layer to be sufficient for preventing metallic luster but not excessively thick. This allows the blackened layer to be formed rapidly by wet method while achieving the required optical performance, resolving the time-consuming issue of conventional dry methods
2Object-affected harmful factors
If a blackened layer is formed to sufficient thickness to prevent metallic luster, then light reflection is prevented, but the formation time increases
Solution Approach 1:
The patent substitutes dry method with wet method for blackened layer formation. The wet method enables faster deposition of the blackened layer to sufficient thickness, reducing the formation time while ensuring metallic luster is effectively prevented
Solution Approach 2:
The patent forms the adhesion layer first using dry plating, which serves as a foundation for subsequent blackened layer formation. This preliminary action ensures proper adhesion and enables efficient wet method processing of the blackened layer, reducing overall formation time
3Strength
If an adhesion layer of Ni-Cu alloy including oxygen is formed by dry plating, then adhesion between transparent base material and metal layer is enhanced, but process complexity increases
Solution Approach 1:
The patent uses a composite Ni-Cu alloy material for the adhesion layer, combining nickel and copper in specific proportions with controlled oxygen content. This composite material provides superior adhesion strength between the transparent base material and metal layer, while the standardized composition simplifies the overall process by eliminating the need for multiple separate layer depositions
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively prevents light reflection on the metal layer surface while maintaining high productivity, ensuring low surface resistivity and visibility for larger touch panel displays.
Implementation Method 1
an adhesion layer formed between the transparent base material and the metal layer by dry plating
Implementation Method 2
a blackened layer formed on the metal layer by a wet method
Data Source
Figure 1A~1B
Figure 2A~2B
Figure 3A~3B
AI summary
A conductive substrate includes a transparent base material; a metal layer formed on at least one of surfaces of the transparent base material; and a blackened layer formed on the metal layer by a wet method.